AMD Xilinx
XCZU7EG-3FBVB900E
XCZU7EG-3FBVB900E ECAD Model
XCZU7EG-3FBVB900E Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 900 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Supply Voltage-Max | 927 mV | |
| Supply Voltage-Min | 873 mV | |
| Temperature Grade | OTHER | |
| JESD-30 Code | R-PBGA-B900 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 900 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, BGA900,30X30,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 |
XCZU7EG-3FBVB900E Datasheet Download
XCZU7EG-3FBVB900E Overview
The XCZU7EG-3FBVB900E chip model is a powerful and versatile model that has been designed to meet the needs of high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with HDL language, which is a high-level language for hardware description and design. This chip model is highly advantageous due to its low power consumption, high performance, and small size.
The XCZU7EG-3FBVB900E chip model is expected to be in high demand in the future due to its versatility and performance. It is expected to be used in a variety of industries, including automotive, medical, industrial, and consumer electronics. The chip model is also expected to be used in robotics, artificial intelligence, and machine learning applications.
The future demand for the XCZU7EG-3FBVB900E chip model is expected to be driven by the need for new technologies to support its application environment. The chip model is expected to be used in applications that require advanced processing capabilities, such as image processing, video processing, and audio processing. Additionally, the chip model is expected to be used in applications that require high-speed data transfer and storage.
The XCZU7EG-3FBVB900E chip model is expected to be in high demand in the future due to its versatility and performance. It is expected to be used in a variety of industries, including automotive, medical, industrial, and consumer electronics. This chip model is also expected to be used in robotics, artificial intelligence, and machine learning applications due to its advanced processing capabilities. Furthermore, the chip model is expected to be used in applications that require high-speed data transfer and storage.
Overall, the XCZU7EG-3FBVB900E chip model is highly advantageous due to its low power consumption, high performance, and small size. It is expected to be in high demand in the future due to its versatility and performance, and its ability to meet the needs of a variety of industries. The chip model is also expected to be used in applications that require advanced processing capabilities, as well as high-speed data transfer and storage. As the need for new technologies to support the application environment increases, so too will the demand for the XCZU7EG-3FBVB900E chip model.
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3,795 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $2,064.1840 | $2,064.1840 |
| 10+ | $2,041.9885 | $20,419.8848 |
| 100+ | $1,931.0108 | $193,101.0849 |
| 1000+ | $1,820.0332 | $910,016.6070 |
| 10000+ | $1,664.6645 | $1,664,664.5250 |
| The price is for reference only, please refer to the actual quotation! | ||