
AMD Xilinx
XCZU7EG-2FFVC1156E
XCZU7EG-2FFVC1156E ECAD Model
XCZU7EG-2FFVC1156E Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Surface Mount | YES | |
Supply Voltage-Nom | 850 mV | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
Technology | CMOS | |
Supply Voltage-Max | 876 mV | |
Supply Voltage-Min | 825 mV | |
Temperature Grade | OTHER | |
JESD-30 Code | R-PBGA-B1156 | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 100 °C | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1156 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Seated Height-Max | 3.51 mm | |
Width | 35 mm | |
Length | 35 mm | |
Ihs Manufacturer | XILINX INC | |
Package Description | BGA, BGA1156,34X34,40 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A002.A.4 | |
HTS Code | 8542.39.00.01 | |
Date Of Intro | 2017-02-15 |
XCZU7EG-2FFVC1156E Datasheet Download
XCZU7EG-2FFVC1156E Overview
XCZU7EG-2FFVC1156E is a high-performance chip model that is suitable for a wide range of applications, such as digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language, which provides the necessary features to create powerful and efficient applications.
The XCZU7EG-2FFVC1156E chip model offers a variety of advantages to its users. It is designed to be power-efficient, allowing for longer battery life and less power consumption. It also offers a high level of performance, allowing for faster processing speeds and more complex calculations. Additionally, the chip model is highly reliable and can handle a wide range of workloads.
The XCZU7EG-2FFVC1156E chip model is expected to see increasing demand in the future due to its versatility and performance. It is likely to be used in a variety of industries, such as automotive, medical, and industrial applications. Additionally, it is likely to be used in many networking applications, such as in wireless networks, as well as in intelligent scenarios, such as in artificial intelligence and machine learning.
In the future, the XCZU7EG-2FFVC1156E chip model is likely to be used in the era of fully intelligent systems. It is likely to be used in a variety of applications, such as in autonomous vehicles, robotics, and smart home systems. Additionally, it is likely to be used in a variety of networking applications, such as in 5G networks and in the Internet of Things.
Overall, the XCZU7EG-2FFVC1156E chip model is a powerful and reliable chip model that is suitable for a wide range of applications. It is designed to be power-efficient and offers a high level of performance. It is expected to see increasing demand in the future due to its versatility and performance, and is likely to be used in a variety of applications in the era of fully intelligent systems.
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1,479 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $1,645.0524 | $1,645.0524 |
10+ | $1,627.3636 | $16,273.6362 |
100+ | $1,538.9199 | $153,891.9945 |
1000+ | $1,450.4763 | $725,238.1350 |
10000+ | $1,326.6551 | $1,326,655.1250 |
The price is for reference only, please refer to the actual quotation! |