XCZU7EG-2FFVC1156E
XCZU7EG-2FFVC1156E
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rohs

AMD Xilinx

XCZU7EG-2FFVC1156E


XCZU7EG-2FFVC1156E
F20-XCZU7EG-2FFVC1156E
Active
CMOS, BGA, BGA1156,34X34,40
BGA, BGA1156,34X34,40

XCZU7EG-2FFVC1156E ECAD Model


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XCZU7EG-2FFVC1156E Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 850 mV
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Supply Voltage-Max 876 mV
Supply Voltage-Min 825 mV
Temperature Grade OTHER
JESD-30 Code R-PBGA-B1156
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1156
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Seated Height-Max 3.51 mm
Width 35 mm
Length 35 mm
Ihs Manufacturer XILINX INC
Package Description BGA, BGA1156,34X34,40
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01
Date Of Intro 2017-02-15

XCZU7EG-2FFVC1156E Datasheet Download


XCZU7EG-2FFVC1156E Overview



XCZU7EG-2FFVC1156E is a high-performance chip model that is suitable for a wide range of applications, such as digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language, which provides the necessary features to create powerful and efficient applications.


The XCZU7EG-2FFVC1156E chip model offers a variety of advantages to its users. It is designed to be power-efficient, allowing for longer battery life and less power consumption. It also offers a high level of performance, allowing for faster processing speeds and more complex calculations. Additionally, the chip model is highly reliable and can handle a wide range of workloads.


The XCZU7EG-2FFVC1156E chip model is expected to see increasing demand in the future due to its versatility and performance. It is likely to be used in a variety of industries, such as automotive, medical, and industrial applications. Additionally, it is likely to be used in many networking applications, such as in wireless networks, as well as in intelligent scenarios, such as in artificial intelligence and machine learning.


In the future, the XCZU7EG-2FFVC1156E chip model is likely to be used in the era of fully intelligent systems. It is likely to be used in a variety of applications, such as in autonomous vehicles, robotics, and smart home systems. Additionally, it is likely to be used in a variety of networking applications, such as in 5G networks and in the Internet of Things.


Overall, the XCZU7EG-2FFVC1156E chip model is a powerful and reliable chip model that is suitable for a wide range of applications. It is designed to be power-efficient and offers a high level of performance. It is expected to see increasing demand in the future due to its versatility and performance, and is likely to be used in a variety of applications in the era of fully intelligent systems.



1,479 In Stock


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Unit Price: $1,768.8735
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $1,645.0524 $1,645.0524
10+ $1,627.3636 $16,273.6362
100+ $1,538.9199 $153,891.9945
1000+ $1,450.4763 $725,238.1350
10000+ $1,326.6551 $1,326,655.1250
The price is for reference only, please refer to the actual quotation!

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