XCZU7EG-2FBVB900I
XCZU7EG-2FBVB900I
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

AMD Xilinx

XCZU7EG-2FBVB900I


XCZU7EG-2FBVB900I
F20-XCZU7EG-2FBVB900I
Active
CMOS, BGA, BGA900,30X30,40
BGA, BGA900,30X30,40

XCZU7EG-2FBVB900I ECAD Model


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XCZU7EG-2FBVB900I Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 850 mV
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Supply Voltage-Max 876 mV
Supply Voltage-Min 825 mV
Temperature Grade INDUSTRIAL
JESD-30 Code R-PBGA-B900
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 900
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description BGA, BGA900,30X30,40
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01

XCZU7EG-2FBVB900I Datasheet Download


XCZU7EG-2FBVB900I Overview



The chip model XCZU7EG-2FBVB900I is a high-performance integrated circuit designed for digital signal processing, embedded processing, and image processing. It is an ideal choice for applications that require the use of HDL language. This chip model is designed to provide users with a reliable and efficient solution for their tasks.


The XCZU7EG-2FBVB900I has many advantages that make it an attractive choice for a variety of applications. This chip model has a very low power consumption, a high clock frequency, and a high-performance computing capability. It also features a wide range of I/O interfaces, making it suitable for a variety of tasks. Additionally, it is equipped with a wide range of memory options, allowing users to customize their system to their specific needs.


In the future, the demand for the XCZU7EG-2FBVB900I is expected to increase significantly in the related industries. This is due to the chip model's high performance and reliability, as well as its low power consumption and wide range of I/O interfaces. Additionally, the XCZU7EG-2FBVB900I is designed to be compatible with a variety of operating systems, making it an ideal choice for a variety of tasks.


When designing a system with the XCZU7EG-2FBVB900I, there are several factors to consider. First, the user must ensure that the chip model is compatible with the operating system they are using. Additionally, users should be aware of the specific design requirements of the chip model and ensure that the system meets these requirements. Finally, users should be aware of any potential issues that may arise with the chip model, such as overheating or power consumption.


To illustrate the use of the XCZU7EG-2FBVB900I, there are several case studies available. In one case study, the chip model was used in an embedded system for a medical device. The system was designed to be low power and high performance, and the XCZU7EG-2FBVB900I was chosen as the ideal processor. In another case study, the chip model was used in an image processing system, where it was used to process high-resolution images in real time.


When using the XCZU7EG-2FBVB900I, there are several precautions to keep in mind. First, users should ensure that the chip model is compatible with the operating system they are using. Additionally, users should be aware of the specific design requirements of the chip model and ensure that the system meets these requirements. Finally, users should be aware of any potential issues that may arise with the chip model, such as overheating or power consumption.


The XCZU7EG-2FBVB900I is a powerful and reliable chip model that is suitable for a variety of applications. It is designed to provide users with a reliable and efficient solution for their tasks, and its low power consumption and wide range of I/O interfaces make it an attractive choice for related industries. With its high performance and reliability, along with its compatibility with a variety of operating systems, the XCZU7EG-2FBVB900I is expected to see an increase in demand in the future. When designing a system with the XCZU7EG-2FBVB900I, users should be aware of the specific design requirements of the chip model and ensure that the system meets these requirements. Additionally, users should be aware of any potential issues that may arise with the chip model, such as overheating or power consumption.



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Unit Price: $1,821.3082
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Pricing (USD)

QTY Unit Price Ext Price
1+ $1,693.8166 $1,693.8166
10+ $1,675.6035 $16,756.0354
100+ $1,584.5381 $158,453.8134
1000+ $1,493.4727 $746,736.3620
10000+ $1,365.9812 $1,365,981.1500
The price is for reference only, please refer to the actual quotation!

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