XCZU7EG-2FBVB900E
XCZU7EG-2FBVB900E
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rohs

AMD Xilinx

XCZU7EG-2FBVB900E


XCZU7EG-2FBVB900E
F20-XCZU7EG-2FBVB900E
Active
CMOS, BGA, BGA900,30X30,40
BGA, BGA900,30X30,40

XCZU7EG-2FBVB900E ECAD Model


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XCZU7EG-2FBVB900E Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 850 mV
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Supply Voltage-Max 876 mV
Supply Voltage-Min 825 mV
Temperature Grade OTHER
JESD-30 Code R-PBGA-B900
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 900
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Seated Height-Max 2.97 mm
Width 31 mm
Length 31 mm
Ihs Manufacturer XILINX INC
Package Description BGA, BGA900,30X30,40
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01
Date Of Intro 2017-02-15

XCZU7EG-2FBVB900E Datasheet Download


XCZU7EG-2FBVB900E Overview



The chip model XCZU7EG-2FBVB900E is an advanced integrated circuit (IC) designed by Xilinx, a leading provider of programmable logic devices. This model is designed to provide a flexible and powerful platform for the development of a variety of applications, including communications, industrial automation, and robotics. It is a highly efficient and low-power device that is suitable for a wide range of applications.


The industry trends of the XCZU7EG-2FBVB900E chip model and the future development of related industries depend on what specific technologies are needed. As the demand for advanced communication systems grows, the chip model can be used to develop and popularize future intelligent robots. It is equipped with a variety of advanced features, including a high-speed, low-power processor core, a large memory, and a wide range of peripheral interfaces.


The original design intention of the chip model XCZU7EG-2FBVB900E is to provide a powerful platform for the development of a variety of applications. It is designed to be flexible and easily upgradable, with the possibility of future upgrades. This chip model is suitable for a wide range of applications, including communications, industrial automation, and robotics. It is also capable of supporting new technologies and applications as they become available.


In order to use the XCZU7EG-2FBVB900E chip model effectively, certain technical talents are needed. The chip model requires an understanding of digital logic design, programming languages, and embedded systems. The user should also have a good knowledge of the architecture of the chip model, its peripherals, and the protocols used for communication. Additionally, the user should have a good understanding of the application environment and the technologies needed to support it.


In conclusion, the XCZU7EG-2FBVB900E chip model is an advanced integrated circuit designed by Xilinx. It is suitable for a wide range of applications, including communications, industrial automation, and robotics. It is capable of supporting new technologies and applications as they become available. To use the chip model effectively, certain technical talents are needed, including an understanding of digital logic design, programming languages, and embedded systems.



4,328 In Stock


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Unit Price: $10,131.2034
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $9,422.0192 $9,422.0192
10+ $9,320.7071 $93,207.0713
100+ $8,814.1470 $881,414.6958
1000+ $8,307.5868 $4,153,793.3940
10000+ $7,598.4026 $7,598,402.5500
The price is for reference only, please refer to the actual quotation!

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