
AMD Xilinx
XCZU7EG-2FBVB900E
XCZU7EG-2FBVB900E ECAD Model
XCZU7EG-2FBVB900E Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Surface Mount | YES | |
Supply Voltage-Nom | 850 mV | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
Technology | CMOS | |
Supply Voltage-Max | 876 mV | |
Supply Voltage-Min | 825 mV | |
Temperature Grade | OTHER | |
JESD-30 Code | R-PBGA-B900 | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 100 °C | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 900 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Seated Height-Max | 2.97 mm | |
Width | 31 mm | |
Length | 31 mm | |
Ihs Manufacturer | XILINX INC | |
Package Description | BGA, BGA900,30X30,40 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A002.A.4 | |
HTS Code | 8542.39.00.01 | |
Date Of Intro | 2017-02-15 |
XCZU7EG-2FBVB900E Datasheet Download
XCZU7EG-2FBVB900E Overview
The chip model XCZU7EG-2FBVB900E is an advanced integrated circuit (IC) designed by Xilinx, a leading provider of programmable logic devices. This model is designed to provide a flexible and powerful platform for the development of a variety of applications, including communications, industrial automation, and robotics. It is a highly efficient and low-power device that is suitable for a wide range of applications.
The industry trends of the XCZU7EG-2FBVB900E chip model and the future development of related industries depend on what specific technologies are needed. As the demand for advanced communication systems grows, the chip model can be used to develop and popularize future intelligent robots. It is equipped with a variety of advanced features, including a high-speed, low-power processor core, a large memory, and a wide range of peripheral interfaces.
The original design intention of the chip model XCZU7EG-2FBVB900E is to provide a powerful platform for the development of a variety of applications. It is designed to be flexible and easily upgradable, with the possibility of future upgrades. This chip model is suitable for a wide range of applications, including communications, industrial automation, and robotics. It is also capable of supporting new technologies and applications as they become available.
In order to use the XCZU7EG-2FBVB900E chip model effectively, certain technical talents are needed. The chip model requires an understanding of digital logic design, programming languages, and embedded systems. The user should also have a good knowledge of the architecture of the chip model, its peripherals, and the protocols used for communication. Additionally, the user should have a good understanding of the application environment and the technologies needed to support it.
In conclusion, the XCZU7EG-2FBVB900E chip model is an advanced integrated circuit designed by Xilinx. It is suitable for a wide range of applications, including communications, industrial automation, and robotics. It is capable of supporting new technologies and applications as they become available. To use the chip model effectively, certain technical talents are needed, including an understanding of digital logic design, programming languages, and embedded systems.
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4,328 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $9,422.0192 | $9,422.0192 |
10+ | $9,320.7071 | $93,207.0713 |
100+ | $8,814.1470 | $881,414.6958 |
1000+ | $8,307.5868 | $4,153,793.3940 |
10000+ | $7,598.4026 | $7,598,402.5500 |
The price is for reference only, please refer to the actual quotation! |