
AMD Xilinx
XCZU7EG-1FFVC1156I
XCZU7EG-1FFVC1156I ECAD Model
XCZU7EG-1FFVC1156I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Surface Mount | YES | |
Supply Voltage-Nom | 850 mV | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
Technology | CMOS | |
Supply Voltage-Max | 876 mV | |
Supply Voltage-Min | 825 mV | |
Temperature Grade | INDUSTRIAL | |
JESD-30 Code | R-PBGA-B1156 | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1156 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Position | BOTTOM | |
Ihs Manufacturer | XILINX INC | |
Package Description | BGA, BGA1156,34X34,40 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A002.A.4 | |
HTS Code | 8542.39.00.01 |
XCZU7EG-1FFVC1156I Datasheet Download
XCZU7EG-1FFVC1156I Overview
The XCZU7EG-1FFVC1156I chip model is an advanced integrated circuit designed by Xilinx, a leading provider of programmable logic solutions. It is a highly efficient and powerful device, designed to meet the needs of modern communication systems. The chip is based on the Xilinx UltraScale+ architecture, and is capable of supporting a wide range of applications, from high-speed data processing to complex digital signal processing.
The chip model XCZU7EG-1FFVC1156I is designed to provide high-performance, low-power performance with a wide range of features. It is capable of supporting up to 8GB of DDR4 memory and up to 8GB of QDR-IV memory. It also supports a variety of communication protocols, including Ethernet, USB, and PCIe. This makes the chip model XCZU7EG-1FFVC1156I well-suited for a variety of applications, including high-speed data processing, digital signal processing, and advanced communication systems.
The XCZU7EG-1FFVC1156I chip model is designed with the future in mind. It is capable of supporting a wide range of intelligent applications and scenarios. For example, it can be used in the next generation of intelligent networks, such as the Internet of Things (IoT). It can also be used in the era of fully intelligent systems, such as autonomous vehicles and smart cities.
The product description of the XCZU7EG-1FFVC1156I chip model includes its features, such as its support for 8GB of DDR4 memory and 8GB of QDR-IV memory, as well as its compatibility with a variety of communication protocols. Additionally, the product description outlines the design requirements of the chip model, such as its power consumption, temperature range, and board dimensions.
To ensure that the chip model XCZU7EG-1FFVC1156I is used in the most efficient and reliable manner, there are a few precautions that should be taken. It is important to ensure that the chip is properly cooled, as it can become overheated if not cooled properly. Additionally, it is important to ensure that the chip is properly powered, as it can become unstable if not powered correctly. Finally, it is important to ensure that the chip is properly integrated into the system, as it can cause issues if not properly integrated.
Case studies of the XCZU7EG-1FFVC1156I chip model have demonstrated its effectiveness in a variety of applications. For example, it has been used in autonomous vehicles to enable high-speed data processing and advanced communication systems. Additionally, it has been used in the development of smart cities, where it has enabled the seamless integration of various intelligent systems.
In conclusion, the XCZU7EG-1FFVC1156I chip model is a powerful and efficient device, designed to meet the needs of modern communication systems. It is capable of supporting a wide range of applications, from high-speed data processing to complex digital signal processing. Additionally, it is capable of supporting a wide range of intelligent applications and scenarios, making it well-suited for the next generation of intelligent networks and the era of fully intelligent systems. To ensure that the chip model is used in the most efficient and reliable manner, it is important to take certain precautions, such as ensuring that it is properly cooled, powered, and integrated into the system. Case studies have demonstrated the effectiveness of the XCZU7EG-1FFVC1156I chip model in a variety of applications and scenarios.
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3,953 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $2,177.9856 | $2,177.9856 |
10+ | $2,154.5664 | $21,545.6640 |
100+ | $2,037.4704 | $203,747.0400 |
1000+ | $1,920.3744 | $960,187.2000 |
10000+ | $1,756.4400 | $1,756,440.0000 |
The price is for reference only, please refer to the actual quotation! |