XCZU7EG-1FFVC1156I
XCZU7EG-1FFVC1156I
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rohs

AMD Xilinx

XCZU7EG-1FFVC1156I


XCZU7EG-1FFVC1156I
F20-XCZU7EG-1FFVC1156I
Active
CMOS, BGA, BGA1156,34X34,40
BGA, BGA1156,34X34,40

XCZU7EG-1FFVC1156I ECAD Model


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XCZU7EG-1FFVC1156I Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 850 mV
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Supply Voltage-Max 876 mV
Supply Voltage-Min 825 mV
Temperature Grade INDUSTRIAL
JESD-30 Code R-PBGA-B1156
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1156
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description BGA, BGA1156,34X34,40
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01

XCZU7EG-1FFVC1156I Datasheet Download


XCZU7EG-1FFVC1156I Overview



The XCZU7EG-1FFVC1156I chip model is an advanced integrated circuit designed by Xilinx, a leading provider of programmable logic solutions. It is a highly efficient and powerful device, designed to meet the needs of modern communication systems. The chip is based on the Xilinx UltraScale+ architecture, and is capable of supporting a wide range of applications, from high-speed data processing to complex digital signal processing.


The chip model XCZU7EG-1FFVC1156I is designed to provide high-performance, low-power performance with a wide range of features. It is capable of supporting up to 8GB of DDR4 memory and up to 8GB of QDR-IV memory. It also supports a variety of communication protocols, including Ethernet, USB, and PCIe. This makes the chip model XCZU7EG-1FFVC1156I well-suited for a variety of applications, including high-speed data processing, digital signal processing, and advanced communication systems.


The XCZU7EG-1FFVC1156I chip model is designed with the future in mind. It is capable of supporting a wide range of intelligent applications and scenarios. For example, it can be used in the next generation of intelligent networks, such as the Internet of Things (IoT). It can also be used in the era of fully intelligent systems, such as autonomous vehicles and smart cities.


The product description of the XCZU7EG-1FFVC1156I chip model includes its features, such as its support for 8GB of DDR4 memory and 8GB of QDR-IV memory, as well as its compatibility with a variety of communication protocols. Additionally, the product description outlines the design requirements of the chip model, such as its power consumption, temperature range, and board dimensions.


To ensure that the chip model XCZU7EG-1FFVC1156I is used in the most efficient and reliable manner, there are a few precautions that should be taken. It is important to ensure that the chip is properly cooled, as it can become overheated if not cooled properly. Additionally, it is important to ensure that the chip is properly powered, as it can become unstable if not powered correctly. Finally, it is important to ensure that the chip is properly integrated into the system, as it can cause issues if not properly integrated.


Case studies of the XCZU7EG-1FFVC1156I chip model have demonstrated its effectiveness in a variety of applications. For example, it has been used in autonomous vehicles to enable high-speed data processing and advanced communication systems. Additionally, it has been used in the development of smart cities, where it has enabled the seamless integration of various intelligent systems.


In conclusion, the XCZU7EG-1FFVC1156I chip model is a powerful and efficient device, designed to meet the needs of modern communication systems. It is capable of supporting a wide range of applications, from high-speed data processing to complex digital signal processing. Additionally, it is capable of supporting a wide range of intelligent applications and scenarios, making it well-suited for the next generation of intelligent networks and the era of fully intelligent systems. To ensure that the chip model is used in the most efficient and reliable manner, it is important to take certain precautions, such as ensuring that it is properly cooled, powered, and integrated into the system. Case studies have demonstrated the effectiveness of the XCZU7EG-1FFVC1156I chip model in a variety of applications and scenarios.



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Unit Price: $2,341.92
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Pricing (USD)

QTY Unit Price Ext Price
1+ $2,177.9856 $2,177.9856
10+ $2,154.5664 $21,545.6640
100+ $2,037.4704 $203,747.0400
1000+ $1,920.3744 $960,187.2000
10000+ $1,756.4400 $1,756,440.0000
The price is for reference only, please refer to the actual quotation!

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