
AMD Xilinx
XCZU7CG-L1FBVB900I
XCZU7CG-L1FBVB900I ECAD Model
XCZU7CG-L1FBVB900I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Surface Mount | YES | |
Supply Voltage-Nom | 720 mV | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
Technology | CMOS | |
Additional Feature | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | |
Supply Voltage-Max | 742 mV | |
Supply Voltage-Min | 698 mV | |
Temperature Grade | INDUSTRIAL | |
JESD-30 Code | R-PBGA-B900 | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 900 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Position | BOTTOM | |
Ihs Manufacturer | XILINX INC | |
Package Description | BGA, BGA900,30X30,40 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A002.A.4 | |
HTS Code | 8542.39.00.01 |
XCZU7CG-L1FBVB900I Datasheet Download
XCZU7CG-L1FBVB900I Overview
The chip model XCZU7CG-L1FBVB900I is a new technology that has been developed to meet the needs of the ever-evolving technology industry. It is a state-of-the-art chip model that offers advanced features and capabilities that are designed to keep up with the changing needs of the industry. This chip model is designed to be used in a wide range of applications, including networks, intelligent scenarios, and even robotics.
As the chip model XCZU7CG-L1FBVB900I continues to develop, the industry trends in the chip model will continue to change. As the technology advances, new features and capabilities will be added to the chip model, making it more efficient and capable of handling new tasks. Additionally, the chip model will be able to support more intelligent scenarios, allowing it to be used in a wider range of applications.
The chip model XCZU7CG-L1FBVB900I is also capable of being used in the era of fully intelligent systems. This chip model is designed to be able to handle complex tasks, such as artificial intelligence, machine learning, and natural language processing. With its advanced capabilities, the chip model is capable of providing a powerful platform for the development and popularization of future intelligent robots.
In order to effectively use the chip model XCZU7CG-L1FBVB900I, certain technical talents are needed. This includes a strong understanding of the technology and its capabilities, as well as a deep understanding of the applications and scenarios that the chip model can be used in. Additionally, it is important to have a good grasp of the programming languages that are necessary to use the chip model effectively. With the right technical talents, the chip model XCZU7CG-L1FBVB900I can be used to its fullest potential.
The chip model XCZU7CG-L1FBVB900I is an advanced technology that is designed to meet the ever-evolving needs of the technology industry. As the chip model continues to develop, it will be capable of handling more tasks and supporting more intelligent scenarios. Additionally, the chip model can be used in the era of fully intelligent systems, allowing it to be used in the development and popularization of future intelligent robots. In order to use the chip model effectively, certain technical talents are needed, including a strong understanding of the technology and its capabilities, as well as a deep understanding of the applications and scenarios that the chip model can be used in.
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3,962 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $2,049.8688 | $2,049.8688 |
10+ | $2,027.8272 | $20,278.2720 |
100+ | $1,917.6192 | $191,761.9200 |
1000+ | $1,807.4112 | $903,705.6000 |
10000+ | $1,653.1200 | $1,653,120.0000 |
The price is for reference only, please refer to the actual quotation! |