XCZU7CG-L1FBVB900I
XCZU7CG-L1FBVB900I
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rohs

AMD Xilinx

XCZU7CG-L1FBVB900I


XCZU7CG-L1FBVB900I
F20-XCZU7CG-L1FBVB900I
Active
CMOS, BGA, BGA900,30X30,40
BGA, BGA900,30X30,40

XCZU7CG-L1FBVB900I ECAD Model


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XCZU7CG-L1FBVB900I Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 720 mV
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Additional Feature ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
Supply Voltage-Max 742 mV
Supply Voltage-Min 698 mV
Temperature Grade INDUSTRIAL
JESD-30 Code R-PBGA-B900
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 900
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description BGA, BGA900,30X30,40
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01

XCZU7CG-L1FBVB900I Datasheet Download


XCZU7CG-L1FBVB900I Overview



The chip model XCZU7CG-L1FBVB900I is a new technology that has been developed to meet the needs of the ever-evolving technology industry. It is a state-of-the-art chip model that offers advanced features and capabilities that are designed to keep up with the changing needs of the industry. This chip model is designed to be used in a wide range of applications, including networks, intelligent scenarios, and even robotics.


As the chip model XCZU7CG-L1FBVB900I continues to develop, the industry trends in the chip model will continue to change. As the technology advances, new features and capabilities will be added to the chip model, making it more efficient and capable of handling new tasks. Additionally, the chip model will be able to support more intelligent scenarios, allowing it to be used in a wider range of applications.


The chip model XCZU7CG-L1FBVB900I is also capable of being used in the era of fully intelligent systems. This chip model is designed to be able to handle complex tasks, such as artificial intelligence, machine learning, and natural language processing. With its advanced capabilities, the chip model is capable of providing a powerful platform for the development and popularization of future intelligent robots.


In order to effectively use the chip model XCZU7CG-L1FBVB900I, certain technical talents are needed. This includes a strong understanding of the technology and its capabilities, as well as a deep understanding of the applications and scenarios that the chip model can be used in. Additionally, it is important to have a good grasp of the programming languages that are necessary to use the chip model effectively. With the right technical talents, the chip model XCZU7CG-L1FBVB900I can be used to its fullest potential.


The chip model XCZU7CG-L1FBVB900I is an advanced technology that is designed to meet the ever-evolving needs of the technology industry. As the chip model continues to develop, it will be capable of handling more tasks and supporting more intelligent scenarios. Additionally, the chip model can be used in the era of fully intelligent systems, allowing it to be used in the development and popularization of future intelligent robots. In order to use the chip model effectively, certain technical talents are needed, including a strong understanding of the technology and its capabilities, as well as a deep understanding of the applications and scenarios that the chip model can be used in.



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Unit Price: $2,204.16
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $2,049.8688 $2,049.8688
10+ $2,027.8272 $20,278.2720
100+ $1,917.6192 $191,761.9200
1000+ $1,807.4112 $903,705.6000
10000+ $1,653.1200 $1,653,120.0000
The price is for reference only, please refer to the actual quotation!

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