AMD Xilinx
XCZU7CG-2FFVF1517I
XCZU7CG-2FFVF1517I ECAD Model
XCZU7CG-2FFVF1517I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 850 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Supply Voltage-Max | 876 mV | |
| Supply Voltage-Min | 825 mV | |
| Temperature Grade | INDUSTRIAL | |
| JESD-30 Code | R-PBGA-B1517 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1517 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, BGA1517,39X39,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 |
XCZU7CG-2FFVF1517I Datasheet Download
XCZU7CG-2FFVF1517I Overview
The XCZU7CG-2FFVF1517I chip model is a powerful and versatile solution for a variety of industries. It is designed to provide high performance, low power consumption, and flexibility for a variety of applications. The chip model has been designed with the intention of providing a comprehensive solution for a variety of applications, from basic communications to advanced communications systems.
The XCZU7CG-2FFVF1517I chip model offers a number of advantages that make it an attractive option for many industries. It is designed to be highly energy-efficient, which can help reduce energy costs in data centers and other facilities. It is also designed to be highly reliable, which makes it a great choice for mission-critical applications. Additionally, it is designed to be flexible and scalable, allowing it to be used in a variety of different scenarios.
The XCZU7CG-2FFVF1517I chip model is expected to see increasing demand in the future as more industries take advantage of its powerful capabilities. It is likely to be used in a variety of applications, from basic communications to advanced communications systems. It is also likely to be used in a variety of intelligent systems, such as self-driving cars, autonomous robots, and other intelligent scenarios. Additionally, it is likely to be used in networks, allowing for greater connectivity and faster data transfer speeds.
The XCZU7CG-2FFVF1517I chip model is also designed to be easily upgradable, allowing for future upgrades and developments. This makes it a great choice for companies that need to keep up with the ever-evolving technology landscape. Additionally, it is designed to be compatible with a variety of different technologies, making it a great choice for many industries.
In conclusion, the XCZU7CG-2FFVF1517I chip model is a powerful and versatile solution for a variety of industries. It is designed to provide high performance, low power consumption, and flexibility for a variety of applications. It is expected to see increasing demand in the future, and it is likely to be used in a variety of different scenarios, from basic communications to advanced communications systems. Additionally, it is designed to be easily upgradable and compatible with a variety of different technologies, making it a great choice for many industries.
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3,646 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,833.3215 | $1,833.3215 |
| 10+ | $1,813.6083 | $18,136.0833 |
| 100+ | $1,715.0427 | $171,504.2658 |
| 1000+ | $1,616.4770 | $808,238.4940 |
| 10000+ | $1,478.4851 | $1,478,485.0500 |
| The price is for reference only, please refer to the actual quotation! | ||