AMD Xilinx
XCZU7CG-2FFVF1517E
XCZU7CG-2FFVF1517E ECAD Model
XCZU7CG-2FFVF1517E Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 850 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Supply Voltage-Max | 876 mV | |
| Supply Voltage-Min | 825 mV | |
| Temperature Grade | OTHER | |
| JESD-30 Code | R-PBGA-B1517 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1517 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Seated Height-Max | 3.51 mm | |
| Width | 40 mm | |
| Length | 40 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, BGA1517,39X39,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 | |
| Date Of Intro | 2017-02-15 |
XCZU7CG-2FFVF1517E Datasheet Download
XCZU7CG-2FFVF1517E Overview
The XCZU7CG-2FFVF1517E chip model is a powerful solution for high-performance digital signal processing, embedded processing, and image processing. It is designed for applications that require the use of HDL language, making it a great choice for engineers who are looking for a reliable, high-performance solution. The XCZU7CG-2FFVF1517E chip model has many advantages, such as its high-performance processing capabilities and its ability to be programmed using HDL language.
In terms of industry trends, the XCZU7CG-2FFVF1517E chip model is expected to be in high demand in the future. This is due to its versatility and its ability to be used in a variety of applications. Its high-performance processing capabilities make it a great choice for applications that require the use of HDL language, and its ability to be programmed using HDL language makes it a great choice for engineers who are looking for a reliable, high-performance solution.
In terms of the application environment, the XCZU7CG-2FFVF1517E chip model may require the support of new technologies in order to be used effectively. This is due to the ever-changing nature of technology, and the need for new technologies to be implemented in order to keep up with the changing times. The chip model may require the use of new technologies in order to be used in the most efficient and effective manner, and this may be necessary in order to ensure that the chip model can be used in the most efficient and effective manner.
Overall, the XCZU7CG-2FFVF1517E chip model is a powerful solution for high-performance digital signal processing, embedded processing, and image processing. It is expected to be in high demand in the future, due to its versatility and its ability to be used in a variety of applications. Its high-performance processing capabilities make it a great choice for applications that require the use of HDL language, and its ability to be programmed using HDL language makes it a great choice for engineers who are looking for a reliable, high-performance solution. It may require the support of new technologies in order to be used in the most efficient and effective manner, and this may be necessary in order to ensure that the chip model can be used in the most efficient and effective manner.
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3,863 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,604.3106 | $1,604.3106 |
| 10+ | $1,587.0600 | $15,870.5998 |
| 100+ | $1,500.8067 | $150,080.6724 |
| 1000+ | $1,414.5535 | $707,276.7320 |
| 10000+ | $1,293.7989 | $1,293,798.9000 |
| The price is for reference only, please refer to the actual quotation! | ||