AMD Xilinx
XCZU7CG-2FFVC1156I
XCZU7CG-2FFVC1156I ECAD Model
XCZU7CG-2FFVC1156I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 850 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Supply Voltage-Max | 876 mV | |
| Supply Voltage-Min | 825 mV | |
| Temperature Grade | INDUSTRIAL | |
| JESD-30 Code | R-PBGA-B1156 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1156 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, BGA1156,34X34,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 |
XCZU7CG-2FFVC1156I Datasheet Download
XCZU7CG-2FFVC1156I Overview
The XCZU7CG-2FFVC1156I chip model is a powerful and versatile product that is suitable for a wide range of applications. It is designed for high-performance digital signal processing, embedded processing, image processing, and other demanding tasks that require the use of HDL language. This chip model is a great choice for those looking for a reliable and powerful solution.
The industry trends of the XCZU7CG-2FFVC1156I chip model and the future development of related industries are dependent on the specific technologies that are needed. As new technologies emerge, the chip model may need to be upgraded to keep up with the times. It is also important to consider whether the application environment requires the support of new technologies.
The original design intention of the XCZU7CG-2FFVC1156I chip model was to provide a reliable and powerful solution for high-performance digital signal processing, embedded processing, image processing, and other tasks. The chip model has the potential for future upgrades, enabling it to be applied to advanced communication systems. With its versatility and power, it is a great choice for those looking for a reliable and powerful solution.
Overall, the XCZU7CG-2FFVC1156I chip model is a great choice for those looking for a reliable and powerful solution. It is designed for high-performance digital signal processing, embedded processing, image processing, and other demanding tasks that require the use of HDL language. The industry trends of the chip model and the future development of related industries are dependent on the specific technologies that are needed. The chip model also has the potential for future upgrades, enabling it to be applied to advanced communication systems.
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2,496 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,754.3099 | $1,754.3099 |
| 10+ | $1,735.4463 | $17,354.4632 |
| 100+ | $1,641.1286 | $164,112.8589 |
| 1000+ | $1,546.8109 | $773,405.4270 |
| 10000+ | $1,414.7660 | $1,414,766.0250 |
| The price is for reference only, please refer to the actual quotation! | ||