
AMD Xilinx
XCZU7CG-2FFVC1156E
XCZU7CG-2FFVC1156E ECAD Model
XCZU7CG-2FFVC1156E Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Surface Mount | YES | |
Supply Voltage-Nom | 850 mV | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
Technology | CMOS | |
Supply Voltage-Max | 876 mV | |
Supply Voltage-Min | 825 mV | |
Temperature Grade | OTHER | |
JESD-30 Code | R-PBGA-B1156 | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 100 °C | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1156 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Seated Height-Max | 3.51 mm | |
Width | 35 mm | |
Length | 35 mm | |
Ihs Manufacturer | XILINX INC | |
Package Description | BGA, BGA1156,34X34,40 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A002.A.4 | |
HTS Code | 8542.39.00.01 | |
Date Of Intro | 2017-02-15 |
XCZU7CG-2FFVC1156E Datasheet Download
XCZU7CG-2FFVC1156E Overview
The Xilinx XCZU7CG-2FFVC1156E chip model is a powerful, low-cost, and highly versatile field-programmable gate array (FPGA) for a variety of applications. It is a 7nm FPGA with a high-performance, low-power design that supports a wide range of features for high-speed data processing, including a memory controller, embedded processor, and DSP blocks. The chip model is designed to meet the needs of a wide range of applications, from consumer electronics to industrial automation.
The XCZU7CG-2FFVC1156E chip model is expected to be in high demand in the future due to its versatile features and low cost. It is expected to be used in a variety of applications, from automotive to industrial automation, as well as in networking and communications. Furthermore, the chip model is expected to be used in the development of intelligent systems and networks, such as those used in the Internet of Things (IoT).
The chip model is expected to be used in a variety of intelligent scenarios, such as facial recognition, natural language processing, and robotics. It is also expected to be used in the development of fully intelligent systems, such as those used in autonomous vehicles. The chip model is expected to be used in the development of networks that are capable of real-time data processing, as well as those that are capable of handling large amounts of data.
In order to meet the needs of the future applications of the XCZU7CG-2FFVC1156E chip model, new technologies and techniques will be needed. These technologies and techniques will need to be designed to handle the increased complexity of the applications, as well as the increased data processing requirements. Furthermore, new technologies and techniques will need to be developed to ensure that the chip model is capable of handling the increased demands of the future applications.
In conclusion, the Xilinx XCZU7CG-2FFVC1156E chip model is expected to be in high demand in the future due to its versatile features and low cost. It is expected to be used in a variety of applications, from automotive to industrial automation, as well as in networking and communications. Furthermore, the chip model is expected to be used in the development of intelligent systems and networks, such as those used in the Internet of Things (IoT). In order to meet the needs of the future applications of the XCZU7CG-2FFVC1156E chip model, new technologies and techniques will be needed.
You May Also Be Interested In
1,639 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $1,535.1761 | $1,535.1761 |
10+ | $1,518.6688 | $15,186.6884 |
100+ | $1,436.1325 | $143,613.2490 |
1000+ | $1,353.5961 | $676,798.0700 |
10000+ | $1,238.0453 | $1,238,045.2500 |
The price is for reference only, please refer to the actual quotation! |