XCZU7CG-2FFVC1156E
XCZU7CG-2FFVC1156E
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rohs

AMD Xilinx

XCZU7CG-2FFVC1156E


XCZU7CG-2FFVC1156E
F20-XCZU7CG-2FFVC1156E
Active
CMOS, BGA, BGA1156,34X34,40
BGA, BGA1156,34X34,40

XCZU7CG-2FFVC1156E ECAD Model


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XCZU7CG-2FFVC1156E Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 850 mV
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Supply Voltage-Max 876 mV
Supply Voltage-Min 825 mV
Temperature Grade OTHER
JESD-30 Code R-PBGA-B1156
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1156
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Seated Height-Max 3.51 mm
Width 35 mm
Length 35 mm
Ihs Manufacturer XILINX INC
Package Description BGA, BGA1156,34X34,40
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01
Date Of Intro 2017-02-15

XCZU7CG-2FFVC1156E Datasheet Download


XCZU7CG-2FFVC1156E Overview



The Xilinx XCZU7CG-2FFVC1156E chip model is a powerful, low-cost, and highly versatile field-programmable gate array (FPGA) for a variety of applications. It is a 7nm FPGA with a high-performance, low-power design that supports a wide range of features for high-speed data processing, including a memory controller, embedded processor, and DSP blocks. The chip model is designed to meet the needs of a wide range of applications, from consumer electronics to industrial automation.


The XCZU7CG-2FFVC1156E chip model is expected to be in high demand in the future due to its versatile features and low cost. It is expected to be used in a variety of applications, from automotive to industrial automation, as well as in networking and communications. Furthermore, the chip model is expected to be used in the development of intelligent systems and networks, such as those used in the Internet of Things (IoT).


The chip model is expected to be used in a variety of intelligent scenarios, such as facial recognition, natural language processing, and robotics. It is also expected to be used in the development of fully intelligent systems, such as those used in autonomous vehicles. The chip model is expected to be used in the development of networks that are capable of real-time data processing, as well as those that are capable of handling large amounts of data.


In order to meet the needs of the future applications of the XCZU7CG-2FFVC1156E chip model, new technologies and techniques will be needed. These technologies and techniques will need to be designed to handle the increased complexity of the applications, as well as the increased data processing requirements. Furthermore, new technologies and techniques will need to be developed to ensure that the chip model is capable of handling the increased demands of the future applications.


In conclusion, the Xilinx XCZU7CG-2FFVC1156E chip model is expected to be in high demand in the future due to its versatile features and low cost. It is expected to be used in a variety of applications, from automotive to industrial automation, as well as in networking and communications. Furthermore, the chip model is expected to be used in the development of intelligent systems and networks, such as those used in the Internet of Things (IoT). In order to meet the needs of the future applications of the XCZU7CG-2FFVC1156E chip model, new technologies and techniques will be needed.



1,639 In Stock


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Unit Price: $1,650.727
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Pricing (USD)

QTY Unit Price Ext Price
1+ $1,535.1761 $1,535.1761
10+ $1,518.6688 $15,186.6884
100+ $1,436.1325 $143,613.2490
1000+ $1,353.5961 $676,798.0700
10000+ $1,238.0453 $1,238,045.2500
The price is for reference only, please refer to the actual quotation!

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