AMD Xilinx
XCZU7CG-2FBVB900I
XCZU7CG-2FBVB900I ECAD Model
XCZU7CG-2FBVB900I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 850 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Supply Voltage-Max | 876 mV | |
| Supply Voltage-Min | 825 mV | |
| Temperature Grade | INDUSTRIAL | |
| JESD-30 Code | R-PBGA-B900 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 900 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, BGA900,30X30,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 |
XCZU7CG-2FBVB900I Datasheet Download
XCZU7CG-2FBVB900I Overview
The chip model XCZU7CG-2FBVB900I is a new chip model developed by Xilinx, a leading provider of programmable logic solutions. This chip model is designed to be used in a wide range of applications, from high-end computing to low-power embedded systems. It is a powerful, high-performance chip model that can be used for a wide range of applications.
The XCZU7CG-2FBVB900I chip model is based on the 7th generation Xilinx UltraScale+ architecture, which provides high-performance, low-power operation and a wide range of features. This chip model is designed to be used in a wide range of applications, including high-performance computing, embedded systems, and communication systems. It is also capable of supporting advanced technologies such as artificial intelligence (AI), machine learning (ML), and deep learning (DL).
In terms of industry trends, the XCZU7CG-2FBVB900I chip model is expected to become increasingly popular in the future. It is expected to be used in a wide range of applications, including networking, embedded systems, and communication systems. It is also expected to be used in a variety of intelligent scenarios, such as autonomous vehicles, robotics, and smart home applications.
As for the future development of the XCZU7CG-2FBVB900I chip model, it is expected to be upgraded to support new technologies and applications. It is expected to be able to support advanced communication systems and networks, as well as the new intelligent systems that are becoming increasingly popular. It is also expected to be able to support the era of fully intelligent systems, with the ability to support the latest AI, ML, and DL technologies.
Overall, the XCZU7CG-2FBVB900I chip model is a powerful, high-performance chip model that is expected to be widely used in a variety of applications and scenarios in the near future. It is expected to be able to support new technologies and applications, as well as the new intelligent systems that are becoming increasingly popular. With its high-performance and low-power operation, it is expected to be an important part of the future of computing and communication systems.
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4,043 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,580.2370 | $1,580.2370 |
| 10+ | $1,563.2452 | $15,632.4523 |
| 100+ | $1,478.2863 | $147,828.6252 |
| 1000+ | $1,393.3273 | $696,663.6360 |
| 10000+ | $1,274.3847 | $1,274,384.7000 |
| The price is for reference only, please refer to the actual quotation! | ||