AMD Xilinx
XCZU7CG-2FBVB900E
XCZU7CG-2FBVB900E ECAD Model
XCZU7CG-2FBVB900E Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 850 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Supply Voltage-Max | 876 mV | |
| Supply Voltage-Min | 825 mV | |
| Temperature Grade | OTHER | |
| JESD-30 Code | R-PBGA-B900 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 900 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Seated Height-Max | 2.97 mm | |
| Width | 31 mm | |
| Length | 31 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, BGA900,30X30,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 | |
| Date Of Intro | 2017-02-15 |
XCZU7CG-2FBVB900E Datasheet Download
XCZU7CG-2FBVB900E Overview
The XCZU7CG-2FBVB900E is a cutting-edge chip model that has revolutionized the industry of chip models. It is a high-performance, low-power FPGA that is designed to meet the needs of a wide range of applications. The XCZU7CG-2FBVB900E offers a wide range of features, including multi-gigabit transceivers, DDR4 memory interfaces, and high-speed serial transceivers. It also offers a powerful processor system, which can support a variety of software applications.
The XCZU7CG-2FBVB900E is designed to provide a high-performance, low-power platform for a variety of applications. It is also designed to be highly scalable, allowing for future upgrades and modifications. The XCZU7CG-2FBVB900E is also designed to be highly reliable, with a long life expectancy.
In terms of industry trends, the XCZU7CG-2FBVB900E is expected to be in high demand in the future. This is due to its high performance, low power, scalability, and reliability. It is expected to be used in a wide range of applications, including communications, industrial, automotive, and consumer electronics. It is also expected to be used in more advanced communication systems, as the chip model is capable of supporting the latest technologies.
In terms of the original design intention of the XCZU7CG-2FBVB900E, the chip model was designed to be flexible and highly scalable. It is designed to be able to support a variety of applications, and to be able to be upgraded and modified in the future. This allows the chip model to remain relevant and up-to-date with the latest technologies and industry trends.
The XCZU7CG-2FBVB900E is a powerful and reliable chip model that is designed to meet the needs of a wide range of applications. It is expected to be in high demand in the future, and is capable of supporting the latest technologies. It is also highly scalable and can be upgraded and modified in the future, allowing it to remain relevant and up-to-date with the latest industry trends.
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3,236 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $2,049.8688 | $2,049.8688 |
| 10+ | $2,027.8272 | $20,278.2720 |
| 100+ | $1,917.6192 | $191,761.9200 |
| 1000+ | $1,807.4112 | $903,705.6000 |
| 10000+ | $1,653.1200 | $1,653,120.0000 |
| The price is for reference only, please refer to the actual quotation! | ||