XCZU7CG-1FFVF1517E
XCZU7CG-1FFVF1517E
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

AMD Xilinx

XCZU7CG-1FFVF1517E


XCZU7CG-1FFVF1517E
F20-XCZU7CG-1FFVF1517E
Active
CMOS, BGA, BGA1517,39X39,40
BGA, BGA1517,39X39,40

XCZU7CG-1FFVF1517E ECAD Model


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XCZU7CG-1FFVF1517E Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 850 mV
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Supply Voltage-Max 876 mV
Supply Voltage-Min 825 mV
Temperature Grade OTHER
JESD-30 Code R-PBGA-B1517
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1517
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description BGA, BGA1517,39X39,40
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01

XCZU7CG-1FFVF1517E Datasheet Download


XCZU7CG-1FFVF1517E Overview



The Xilinx XCZU7CG-1FFVF1517E chip model is a powerful and flexible programmable logic device that combines the best of FPGA and SoC technologies. It is designed to enable designers to rapidly implement complex systems with high-performance, low-power, and low-cost solutions. The XCZU7CG-1FFVF1517E chip model is a great choice for advanced communication systems, as it provides a high level of integration, flexibility, and scalability.


The XCZU7CG-1FFVF1517E chip model includes a range of features to meet the needs of designers for high-performance, low-power, and low-cost solutions. It features a high-performance, low-power, and low-cost FPGA fabric, as well as a range of integrated peripherals, such as Ethernet, USB, and JTAG. The chip model also includes a range of memory interfaces, including DDR4, QDRII+, and RLDRAM3. Additionally, the XCZU7CG-1FFVF1517E chip model includes on-chip debug and trace capabilities, as well as an integrated power management unit.


The XCZU7CG-1FFVF1517E chip model is designed to enable designers to rapidly implement complex systems with high-performance, low-power, and low-cost solutions. It is designed to enable designers to rapidly create and deploy custom hardware designs, as well as to enable the implementation of complex systems with high-performance, low-power, and low-cost solutions. Additionally, the XCZU7CG-1FFVF1517E chip model is designed for future upgrades, allowing designers to quickly and easily upgrade the chip model as technology advances.


The XCZU7CG-1FFVF1517E chip model can be applied to the development and popularization of future intelligent robots, as it provides a high level of integration, flexibility, and scalability. To use the XCZU7CG-1FFVF1517E chip model effectively, designers need a range of technical skills, including knowledge of FPGA and SoC technologies, as well as experience in designing embedded systems. Additionally, designers should be familiar with the XCZU7CG-1FFVF1517E chip model and its associated development tools.


When using the XCZU7CG-1FFVF1517E chip model, designers should be aware of the potential risks associated with the chip model and should take appropriate precautions. For example, designers should be aware of the potential for electrical overstress and should take appropriate steps to protect the device from damage. Additionally, designers should be aware of the potential for thermal overstress and should take appropriate steps to ensure that the device is adequately cooled.


In conclusion, the Xilinx XCZU7CG-1FFVF1517E chip model is a powerful and flexible programmable logic device that combines the best of FPGA and SoC technologies. It is designed to enable designers to rapidly implement complex systems with high-performance, low-power, and low-cost solutions. The XCZU7CG-1FFVF1517E chip model is a great choice for advanced communication systems, as it provides a high level of integration, flexibility, and scalability. It is also designed for future upgrades, allowing designers to quickly and easily upgrade the chip model as technology advances. Additionally, the XCZU7CG-1FFVF1517E chip model can be applied to the development and popularization of future intelligent robots, as it provides a high level of integration, flexibility, and scalability. However, designers should be aware of the potential risks associated with the chip model and should take appropriate precautions.



2,955 In Stock


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Unit Price: $1,826.304
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Pricing (USD)

QTY Unit Price Ext Price
1+ $1,698.4627 $1,698.4627
10+ $1,680.1997 $16,801.9968
100+ $1,588.8845 $158,888.4480
1000+ $1,497.5693 $748,784.6400
10000+ $1,369.7280 $1,369,728.0000
The price is for reference only, please refer to the actual quotation!

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