
AMD Xilinx
XCZU7CG-1FFVC1156E
XCZU7CG-1FFVC1156E ECAD Model
XCZU7CG-1FFVC1156E Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Surface Mount | YES | |
Supply Voltage-Nom | 850 mV | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
Technology | CMOS | |
Supply Voltage-Max | 876 mV | |
Supply Voltage-Min | 825 mV | |
Temperature Grade | OTHER | |
JESD-30 Code | R-PBGA-B1156 | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 100 °C | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1156 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Position | BOTTOM | |
Ihs Manufacturer | XILINX INC | |
Package Description | BGA, BGA1156,34X34,40 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A002.A.4 | |
HTS Code | 8542.39.00.01 |
XCZU7CG-1FFVC1156E Datasheet Download
XCZU7CG-1FFVC1156E Overview
The XCZU7CG-1FFVC1156E chip model is a high-performance, versatile model that is suitable for a wide range of applications, such as digital signal processing, embedded processing, and image processing. To use this chip model, one must use a hardware description language (HDL) to describe the design of the chip.
The industry trends of the XCZU7CG-1FFVC1156E chip model and the future development of related industries depend on the specific technologies needed to support the application environment. The original design intention of the chip model was to provide a versatile and powerful solution for a variety of applications, and it is possible that future upgrades will be necessary to keep up with the ever-evolving technologies.
The XCZU7CG-1FFVC1156E chip model is also suitable for advanced communication systems, such as 5G. In order to make the most of the chip model, it is important to ensure that the application environment is up-to-date with the latest technologies. This will help ensure that the chip model can be used to its fullest potential and can keep up with the demands of the industry.
Overall, the XCZU7CG-1FFVC1156E chip model is a powerful and versatile solution for a variety of applications. It requires the use of HDL language and can be used for high-performance digital signal processing, embedded processing, image processing, and advanced communication systems. The industry trends and future development of related industries depend on the specific technologies needed for the application environment, and the chip model can be upgraded to keep up with the ever-evolving technologies.
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3,208 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $1,625.2531 | $1,625.2531 |
10+ | $1,607.7773 | $16,077.7728 |
100+ | $1,520.3981 | $152,039.8080 |
1000+ | $1,433.0189 | $716,509.4400 |
10000+ | $1,310.6880 | $1,310,688.0000 |
The price is for reference only, please refer to the actual quotation! |