XCZU7CG-1FFVC1156E
XCZU7CG-1FFVC1156E
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

AMD Xilinx

XCZU7CG-1FFVC1156E


XCZU7CG-1FFVC1156E
F20-XCZU7CG-1FFVC1156E
Active
CMOS, BGA, BGA1156,34X34,40
BGA, BGA1156,34X34,40

XCZU7CG-1FFVC1156E ECAD Model


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XCZU7CG-1FFVC1156E Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 850 mV
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Supply Voltage-Max 876 mV
Supply Voltage-Min 825 mV
Temperature Grade OTHER
JESD-30 Code R-PBGA-B1156
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1156
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description BGA, BGA1156,34X34,40
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01

XCZU7CG-1FFVC1156E Datasheet Download


XCZU7CG-1FFVC1156E Overview



The XCZU7CG-1FFVC1156E chip model is a high-performance, versatile model that is suitable for a wide range of applications, such as digital signal processing, embedded processing, and image processing. To use this chip model, one must use a hardware description language (HDL) to describe the design of the chip.


The industry trends of the XCZU7CG-1FFVC1156E chip model and the future development of related industries depend on the specific technologies needed to support the application environment. The original design intention of the chip model was to provide a versatile and powerful solution for a variety of applications, and it is possible that future upgrades will be necessary to keep up with the ever-evolving technologies.


The XCZU7CG-1FFVC1156E chip model is also suitable for advanced communication systems, such as 5G. In order to make the most of the chip model, it is important to ensure that the application environment is up-to-date with the latest technologies. This will help ensure that the chip model can be used to its fullest potential and can keep up with the demands of the industry.


Overall, the XCZU7CG-1FFVC1156E chip model is a powerful and versatile solution for a variety of applications. It requires the use of HDL language and can be used for high-performance digital signal processing, embedded processing, image processing, and advanced communication systems. The industry trends and future development of related industries depend on the specific technologies needed for the application environment, and the chip model can be upgraded to keep up with the ever-evolving technologies.



3,208 In Stock


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Unit Price: $1,747.584
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $1,625.2531 $1,625.2531
10+ $1,607.7773 $16,077.7728
100+ $1,520.3981 $152,039.8080
1000+ $1,433.0189 $716,509.4400
10000+ $1,310.6880 $1,310,688.0000
The price is for reference only, please refer to the actual quotation!

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