AMD Xilinx
XCZU7CG-1FBVB900I
XCZU7CG-1FBVB900I ECAD Model
XCZU7CG-1FBVB900I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 850 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Supply Voltage-Max | 876 mV | |
| Supply Voltage-Min | 825 mV | |
| Temperature Grade | INDUSTRIAL | |
| JESD-30 Code | R-PBGA-B900 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 900 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, BGA900,30X30,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 |
XCZU7CG-1FBVB900I Datasheet Download
XCZU7CG-1FBVB900I Overview
The XCZU7CG-1FBVB900I chip model is a powerful and versatile processor designed to meet the needs of high-performance digital signal processing, embedded processing, and image processing applications. It requires the use of HDL language for programming and is capable of delivering impressive performance. Its original design intention was to provide a reliable and efficient processor that could be used in a wide range of applications, while being able to be upgraded and adapted to fit the needs of the user.
The XCZU7CG-1FBVB900I chip can be used in many advanced communication systems, such as 5G networks and beyond. It is capable of performing complex computing tasks, allowing for the development of sophisticated applications and intelligent systems. Its powerful capabilities make it ideal for use in the era of fully intelligent systems, such as autonomous vehicles and smart homes. With its ability to process large amounts of data quickly and efficiently, the XCZU7CG-1FBVB900I chip is a perfect choice for any application requiring advanced computing power.
In addition, the XCZU7CG-1FBVB900I chip is also well suited for applications in the field of machine learning and artificial intelligence. It can be used to develop intelligent systems that are capable of making decisions based on data inputs. This chip model can also be used to create complex algorithms and models that can be used to identify patterns in data and make predictions. By using this chip model, developers can create powerful and sophisticated systems that can be used to automate processes and improve decision-making in a variety of industries.
The XCZU7CG-1FBVB900I chip model is a powerful and versatile processor that can be used in a variety of applications. Its ability to process large amounts of data quickly and efficiently, as well as its potential for future upgrades, make it an ideal choice for any application requiring advanced computing power. By using this chip model, developers can create powerful and sophisticated systems that can be used to automate processes and improve decision-making in a variety of industries. With its powerful capabilities, the XCZU7CG-1FBVB900I chip is a perfect choice for any application requiring advanced computing power and is well suited for use in the era of fully intelligent systems.
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4,866 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,830.2400 | $1,830.2400 |
| 10+ | $1,810.5600 | $18,105.6000 |
| 100+ | $1,712.1600 | $171,216.0000 |
| 1000+ | $1,613.7600 | $806,880.0000 |
| 10000+ | $1,476.0000 | $1,476,000.0000 |
| The price is for reference only, please refer to the actual quotation! | ||