
AMD Xilinx
XCZU7CG-1FBVB900E
XCZU7CG-1FBVB900E ECAD Model
XCZU7CG-1FBVB900E Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Surface Mount | YES | |
Supply Voltage-Nom | 850 mV | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
Technology | CMOS | |
Supply Voltage-Max | 876 mV | |
Supply Voltage-Min | 825 mV | |
Temperature Grade | OTHER | |
JESD-30 Code | R-PBGA-B900 | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 100 °C | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 900 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Position | BOTTOM | |
Ihs Manufacturer | XILINX INC | |
Package Description | BGA, BGA900,30X30,40 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A002.A.4 | |
HTS Code | 8542.39.00.01 |
XCZU7CG-1FBVB900E Datasheet Download
XCZU7CG-1FBVB900E Overview
The chip model XCZU7CG-1FBVB900E is a cutting-edge technology developed by Xilinx, Inc., a leading provider of programmable logic solutions. It is the first field-programmable gate array (FPGA) to feature Xilinx's UltraScale+ VU9P architecture, which is designed to deliver the highest performance, lowest power, and highest system integration density for data centers, communications, and other applications.
The XCZU7CG-1FBVB900E is designed to enable a wide range of applications, including high-speed networking, high-performance computing, and advanced communications. It provides a scalable, high-performance platform for applications such as machine learning, artificial intelligence, and 5G wireless. With its UltraScale+ architecture, the XCZU7CG-1FBVB900E can support up to 900K logic elements, up to 500Mbits/s of transceiver bandwidth, and up to 4.2TFLOPS of DSP performance.
The XCZU7CG-1FBVB900E is designed to be highly flexible and configurable, allowing users to easily customize the chip for their specific application requirements. The chip supports a variety of interface standards, including Ethernet, PCIe, and Serial RapidIO, as well as a range of communication protocols, such as OpenFlow and OpenStack. It also supports a range of advanced features, such as dynamic partial reconfiguration and advanced security features, making it an ideal choice for applications such as network security, network monitoring, and network analytics.
The XCZU7CG-1FBVB900E is designed to be highly reliable and robust, and it is also designed to be upgradeable. This allows users to upgrade and expand their system over time as new technologies are released and new applications are developed. It is also designed to be highly energy efficient, making it an ideal choice for applications such as edge computing and distributed computing.
The XCZU7CG-1FBVB900E is designed to be used in a wide range of applications, including next-generation networks, data centers, and the Internet of Things. It is also designed to be used in advanced communication systems, such as 5G wireless, satellite communications, and optical networks. It is also ideal for intelligent scenarios, such as autonomous vehicles and smart cities. With its high performance, low power, and advanced features, the XCZU7CG-1FBVB900E is an excellent choice for applications requiring the highest levels of performance, reliability, and scalability.
You May Also Be Interested In
5,256 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $7,176.3744 | $7,176.3744 |
10+ | $7,099.2091 | $70,992.0907 |
100+ | $6,713.3825 | $671,338.2492 |
1000+ | $6,327.5559 | $3,163,777.9560 |
10000+ | $5,787.3987 | $5,787,398.7000 |
The price is for reference only, please refer to the actual quotation! |