XCZU7CG-1FBVB900E
XCZU7CG-1FBVB900E
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

AMD Xilinx

XCZU7CG-1FBVB900E


XCZU7CG-1FBVB900E
F20-XCZU7CG-1FBVB900E
Active
CMOS, BGA, BGA900,30X30,40
BGA, BGA900,30X30,40

XCZU7CG-1FBVB900E ECAD Model


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XCZU7CG-1FBVB900E Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 850 mV
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Supply Voltage-Max 876 mV
Supply Voltage-Min 825 mV
Temperature Grade OTHER
JESD-30 Code R-PBGA-B900
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 900
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description BGA, BGA900,30X30,40
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01

XCZU7CG-1FBVB900E Datasheet Download


XCZU7CG-1FBVB900E Overview



The chip model XCZU7CG-1FBVB900E is a cutting-edge technology developed by Xilinx, Inc., a leading provider of programmable logic solutions. It is the first field-programmable gate array (FPGA) to feature Xilinx's UltraScale+ VU9P architecture, which is designed to deliver the highest performance, lowest power, and highest system integration density for data centers, communications, and other applications.


The XCZU7CG-1FBVB900E is designed to enable a wide range of applications, including high-speed networking, high-performance computing, and advanced communications. It provides a scalable, high-performance platform for applications such as machine learning, artificial intelligence, and 5G wireless. With its UltraScale+ architecture, the XCZU7CG-1FBVB900E can support up to 900K logic elements, up to 500Mbits/s of transceiver bandwidth, and up to 4.2TFLOPS of DSP performance.


The XCZU7CG-1FBVB900E is designed to be highly flexible and configurable, allowing users to easily customize the chip for their specific application requirements. The chip supports a variety of interface standards, including Ethernet, PCIe, and Serial RapidIO, as well as a range of communication protocols, such as OpenFlow and OpenStack. It also supports a range of advanced features, such as dynamic partial reconfiguration and advanced security features, making it an ideal choice for applications such as network security, network monitoring, and network analytics.


The XCZU7CG-1FBVB900E is designed to be highly reliable and robust, and it is also designed to be upgradeable. This allows users to upgrade and expand their system over time as new technologies are released and new applications are developed. It is also designed to be highly energy efficient, making it an ideal choice for applications such as edge computing and distributed computing.


The XCZU7CG-1FBVB900E is designed to be used in a wide range of applications, including next-generation networks, data centers, and the Internet of Things. It is also designed to be used in advanced communication systems, such as 5G wireless, satellite communications, and optical networks. It is also ideal for intelligent scenarios, such as autonomous vehicles and smart cities. With its high performance, low power, and advanced features, the XCZU7CG-1FBVB900E is an excellent choice for applications requiring the highest levels of performance, reliability, and scalability.



5,256 In Stock


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Unit Price: $7,716.5316
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Pricing (USD)

QTY Unit Price Ext Price
1+ $7,176.3744 $7,176.3744
10+ $7,099.2091 $70,992.0907
100+ $6,713.3825 $671,338.2492
1000+ $6,327.5559 $3,163,777.9560
10000+ $5,787.3987 $5,787,398.7000
The price is for reference only, please refer to the actual quotation!

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