AMD Xilinx
XCZU6EG-3FFVB1156E
XCZU6EG-3FFVB1156E ECAD Model
XCZU6EG-3FFVB1156E Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 900 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Supply Voltage-Max | 927 mV | |
| Supply Voltage-Min | 873 mV | |
| Temperature Grade | OTHER | |
| JESD-30 Code | R-PBGA-B1156 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1156 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, BGA1156,34X34,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 |
XCZU6EG-3FFVB1156E Datasheet Download
XCZU6EG-3FFVB1156E Overview
The XCZU6EG-3FFVB1156E chip model is a powerful and versatile device that can be used for a variety of applications. It is well-suited for high-performance digital signal processing, embedded processing, image processing, and other applications that require the use of HDL language. This chip model is designed to provide users with a reliable and efficient platform to develop and deploy their projects.
The product description of the XCZU6EG-3FFVB1156E chip model includes details about the device's features, design parameters, and performance capabilities. It also provides users with information about the device's power consumption, thermal performance, and other important factors. Additionally, this model also includes case studies and precautions to help users understand the device's capabilities and limitations.
The XCZU6EG-3FFVB1156E chip model is also suitable for use in developing and popularizing future intelligent robots. The device is powerful enough to handle complex tasks, and its features and design parameters are flexible enough to meet the requirements of a wide range of robotic applications. To effectively use this model, users will need to possess technical expertise in HDL language, as well as knowledge of the device's features and design parameters.
Overall, the XCZU6EG-3FFVB1156E chip model is an ideal device for a variety of applications, including high-performance digital signal processing, embedded processing, image processing, and the development and popularization of future intelligent robots. With the right technical expertise and knowledge of the device's features and design parameters, users can leverage this device to create powerful and efficient projects.
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5,321 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $2,155.5418 | $2,155.5418 |
| 10+ | $2,132.3639 | $21,323.6395 |
| 100+ | $2,016.4746 | $201,647.4603 |
| 1000+ | $1,900.5853 | $950,292.6290 |
| 10000+ | $1,738.3402 | $1,738,340.1750 |
| The price is for reference only, please refer to the actual quotation! | ||