
AMD Xilinx
XCZU6EG-2FFVC900I
XCZU6EG-2FFVC900I ECAD Model
XCZU6EG-2FFVC900I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Surface Mount | YES | |
Supply Voltage-Nom | 850 mV | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
Technology | CMOS | |
Supply Voltage-Max | 876 mV | |
Supply Voltage-Min | 825 mV | |
Temperature Grade | INDUSTRIAL | |
JESD-30 Code | R-PBGA-B900 | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 900 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Position | BOTTOM | |
Ihs Manufacturer | XILINX INC | |
Package Description | BGA, BGA900,30X30,40 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A002.A.4 | |
HTS Code | 8542.39.00.01 |
XCZU6EG-2FFVC900I Datasheet Download
XCZU6EG-2FFVC900I Overview
The chip model XCZU6EG-2FFVC900I is a powerful, high-performance Field Programmable Gate Array (FPGA) that is designed to meet the current and future needs of the networking industry. It is equipped with the latest technology, providing high-speed data transfer and low latency. The chip model XCZU6EG-2FFVC900I supports a wide range of applications, from large-scale networks to small-scale embedded systems.
The industry trends of the chip model XCZU6EG-2FFVC900I are constantly changing and evolving, as new technologies and applications are developed. As such, it is important to understand the current and future needs of the industry in order to determine which new technologies are required for the application environment. For example, the chip model XCZU6EG-2FFVC900I can be used in networks to provide high-speed data transfer and low latency. It can also be used in intelligent scenarios, such as autonomous vehicle systems, to provide the necessary computing power.
The product description and specific design requirements of the chip model XCZU6EG-2FFVC900I are detailed in the manufacturer's product manual. The manual outlines the features, specifications, and design requirements of the chip model XCZU6EG-2FFVC900I. It also provides information on how to install and configure the chip model XCZU6EG-2FFVC900I, as well as any precautions that need to be taken when using the chip model.
In addition to the product manual, there are also a number of case studies and tutorials available that provide further information on the chip model XCZU6EG-2FFVC900I. These case studies and tutorials provide detailed information on how to use the chip model in various applications, such as network and intelligent scenarios. They also provide information on how to configure the chip model for the best performance and reliability.
The chip model XCZU6EG-2FFVC900I is a powerful, high-performance FPGA that is designed to meet the current and future needs of the networking industry. It is equipped with the latest technology, providing high-speed data transfer and low latency. With its wide range of applications, from large-scale networks to small-scale embedded systems, the chip model XCZU6EG-2FFVC900I is capable of being used in the era of fully intelligent systems. By understanding the industry trends and the specific design requirements of the chip model, as well as taking advantage of the available case studies and tutorials, users can ensure that they are using the chip model XCZU6EG-2FFVC900I to its fullest potential.
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3,016 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $1,565.4220 | $1,565.4220 |
10+ | $1,548.5895 | $15,485.8954 |
100+ | $1,464.4271 | $146,442.7065 |
1000+ | $1,380.2646 | $690,132.2950 |
10000+ | $1,262.4371 | $1,262,437.1250 |
The price is for reference only, please refer to the actual quotation! |