AMD Xilinx
XCZU6EG-2FFVB1156E
XCZU6EG-2FFVB1156E ECAD Model
XCZU6EG-2FFVB1156E Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 850 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Supply Voltage-Max | 876 mV | |
| Supply Voltage-Min | 825 mV | |
| Temperature Grade | OTHER | |
| JESD-30 Code | R-PBGA-B1156 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1156 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Seated Height-Max | 3.42 mm | |
| Width | 35 mm | |
| Length | 35 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, BGA1156,34X34,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 | |
| Date Of Intro | 2017-02-15 |
XCZU6EG-2FFVB1156E Datasheet Download
XCZU6EG-2FFVB1156E Overview
The XCZU6EG-2FFVB1156E chip model is a powerful and efficient digital signal processor developed by Xilinx. It is suitable for high-performance digital signal processing, embedded processing, image processing, and other applications that require the use of HDL language. Its original design intention was to provide a high-performance, low-cost solution for digital signal processing applications.
The XCZU6EG-2FFVB1156E chip model is capable of supporting future upgrades, making it a versatile and reliable choice for digital signal processing applications. It is also capable of being used in advanced communication systems, such as 5G and 6G networks, as well as the development and popularization of future intelligent robots. The chip model is designed to be highly customizable and can be used to create a wide range of applications.
To use the XCZU6EG-2FFVB1156E chip model effectively, it is important to have a strong understanding of HDL language and digital signal processing. Additionally, experience in embedded systems, image processing, and other related technologies can be beneficial. With the right technical talents and knowledge, the XCZU6EG-2FFVB1156E chip model can be used to create powerful and efficient digital signal processing applications.
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4,197 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $2,294.2058 | $2,294.2058 |
| 10+ | $2,269.5370 | $22,695.3696 |
| 100+ | $2,146.1926 | $214,619.2560 |
| 1000+ | $2,022.8482 | $1,011,424.0800 |
| 10000+ | $1,850.1660 | $1,850,166.0000 |
| The price is for reference only, please refer to the actual quotation! | ||