XCZU6EG-1FFVC900I
XCZU6EG-1FFVC900I
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rohs

AMD Xilinx

XCZU6EG-1FFVC900I


XCZU6EG-1FFVC900I
F20-XCZU6EG-1FFVC900I
Active
CMOS, BGA, BGA900,30X30,40
BGA, BGA900,30X30,40

XCZU6EG-1FFVC900I ECAD Model


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XCZU6EG-1FFVC900I Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 850 mV
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Supply Voltage-Max 876 mV
Supply Voltage-Min 825 mV
Temperature Grade INDUSTRIAL
JESD-30 Code R-PBGA-B900
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 900
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description BGA, BGA900,30X30,40
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01

XCZU6EG-1FFVC900I Datasheet Download


XCZU6EG-1FFVC900I Overview



The XCZU6EG-1FFVC900I chip model is a powerful new model from Xilinx, a leader in FPGA technology. It is the first model in the Xilinx UltraScale+ family to feature 900K logic cells and is designed to provide high performance and scalability for a wide range of applications. The model is also equipped with a variety of features such as high-speed transceivers, high-bandwidth memory controllers, and advanced system integration capabilities.


The XCZU6EG-1FFVC900I chip model is expected to be in high demand in the near future due to its advanced features and scalability. It is well suited for use in a variety of industries, including communications, industrial automation, automotive, aerospace, and medical applications. The model can easily be integrated into existing systems and can be used to develop new applications. It is also an ideal choice for designing and implementing advanced communication systems.


The XCZU6EG-1FFVC900I chip model also has the potential to be used in the development and popularization of future intelligent robots. It can be used to develop sophisticated algorithms and control systems for robots, as well as to provide the necessary processing power for complex tasks. To use the model effectively, it is necessary to have a strong understanding of digital signal processing, robotics, and artificial intelligence.


Overall, the XCZU6EG-1FFVC900I chip model is a powerful and versatile model that can be used in a variety of applications. It is expected to be in high demand in the near future, and its potential for use in the development of intelligent robots is especially promising. With its advanced features and scalability, the model is sure to be a valuable asset in many industries.



3,712 In Stock


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Unit Price: $1,949.304
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $1,812.8527 $1,812.8527
10+ $1,793.3597 $17,933.5968
100+ $1,695.8945 $169,589.4480
1000+ $1,598.4293 $799,214.6400
10000+ $1,461.9780 $1,461,978.0000
The price is for reference only, please refer to the actual quotation!

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