AMD Xilinx
XCZU6EG-1FFVC900E
XCZU6EG-1FFVC900E ECAD Model
XCZU6EG-1FFVC900E Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 850 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Supply Voltage-Max | 876 mV | |
| Supply Voltage-Min | 825 mV | |
| Temperature Grade | OTHER | |
| JESD-30 Code | R-PBGA-B900 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 900 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, BGA900,30X30,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 |
XCZU6EG-1FFVC900E Datasheet Download
XCZU6EG-1FFVC900E Overview
The XCZU6EG-1FFVC900E chip model is a high-performance digital signal processing, embedded processing and image processing solution. It is designed for use with the HDL language, allowing for the development of high-performance, low-power applications. This chip model is ideal for applications that require a high level of performance and scalability.
The XCZU6EG-1FFVC900E chip model is the latest in a series of chips that have been designed to meet the needs of a wide range of industries. It is designed to meet the needs of applications that require high-performance digital signal processing, embedded processing and image processing. This chip model is capable of handling large amounts of data quickly and efficiently, making it an ideal solution for applications that require high levels of performance.
The XCZU6EG-1FFVC900E chip model offers several advantages over other solutions. It is designed to be power efficient, allowing for longer battery life and lower power consumption. Additionally, it is designed to be highly scalable, allowing for the development of applications that can easily scale up or down depending on the needs of the application. Finally, this chip model is designed to be highly reliable, with a high level of performance and reliability.
The demand for the XCZU6EG-1FFVC900E chip model is expected to continue to rise in the future. This is due to its high performance, scalability, and power efficiency. Additionally, as more applications require high-performance digital signal processing, embedded processing, and image processing, the demand for this chip model is expected to increase.
The future of the XCZU6EG-1FFVC900E chip model will depend on the specific technologies and applications that are needed. As new technologies are developed, the chip model will need to be updated to support them. Additionally, as new applications are developed, the chip model will need to be able to handle their needs. As such, the chip model will need to be updated and improved to meet the demands of the future.
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5,822 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $6,218.3457 | $6,218.3457 |
| 10+ | $6,151.4817 | $61,514.8174 |
| 100+ | $5,817.1621 | $581,716.2084 |
| 1000+ | $5,482.8424 | $2,741,421.2120 |
| 10000+ | $5,014.7949 | $5,014,794.9000 |
| The price is for reference only, please refer to the actual quotation! | ||