XCZU6EG-1FFVB1156E
XCZU6EG-1FFVB1156E
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

AMD Xilinx

XCZU6EG-1FFVB1156E


XCZU6EG-1FFVB1156E
F20-XCZU6EG-1FFVB1156E
Active
CMOS, BGA, BGA1156,34X34,40
BGA, BGA1156,34X34,40

XCZU6EG-1FFVB1156E ECAD Model


Download the free Library Loader to convert this file for your ECAD Tool. Learn more about ECAD Model.

XCZU6EG-1FFVB1156E Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 850 mV
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Supply Voltage-Max 876 mV
Supply Voltage-Min 825 mV
Temperature Grade OTHER
JESD-30 Code R-PBGA-B1156
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1156
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description BGA, BGA1156,34X34,40
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01

XCZU6EG-1FFVB1156E Datasheet Download


XCZU6EG-1FFVB1156E Overview



The XCZU6EG-1FFVB1156E chip model is an advanced integrated circuit (IC) designed to meet the needs of modern communication systems. It is a high-performance, low-power device that offers a wide range of features and functions. With its high-speed data processing capabilities, it is capable of supporting multiple applications in the field of communication.


The XCZU6EG-1FFVB1156E chip model was designed with the intention of providing a reliable and efficient solution for communication networks. It is capable of supporting multiple applications such as voice, video, and data transmission. It offers a wide range of features and functions that make it suitable for use in advanced communication systems. It has a high-speed data processing capability and can be used for applications such as high-speed data transfer and multimedia streaming.


The XCZU6EG-1FFVB1156E chip model is suitable for use in the era of fully intelligent systems. It offers a wide range of features and functions that make it suitable for use in advanced communication networks. It supports a variety of intelligent scenarios such as voice recognition, facial recognition, image processing, and machine learning. It also offers a wide range of features and functions that make it suitable for use in the era of fully intelligent systems.


The XCZU6EG-1FFVB1156E chip model has been designed to meet specific design requirements. It has a wide range of features and functions that make it suitable for use in communication networks. It offers a high-speed data processing capability and can be used for applications such as high-speed data transfer and multimedia streaming. It also has a low power consumption and is capable of supporting multiple applications in the field of communication.


In addition, the XCZU6EG-1FFVB1156E chip model is capable of being upgraded in the future. It offers a wide range of features and functions that make it suitable for use in advanced communication systems. It is also capable of being used in the era of fully intelligent systems. Furthermore, actual case studies and precautions must be taken into account when using this chip model.



3,344 In Stock


I want to buy

Unit Price: $1,762.344
The price is for reference only.
paypal mastercard unionpay dhl fedex ups

Pricing (USD)

QTY Unit Price Ext Price
1+ $1,638.9799 $1,638.9799
10+ $1,621.3565 $16,213.5648
100+ $1,533.2393 $153,323.9280
1000+ $1,445.1221 $722,561.0400
10000+ $1,321.7580 $1,321,758.0000
The price is for reference only, please refer to the actual quotation!

Quick Quote