
AMD Xilinx
XCZU6EG-1FFVB1156E
XCZU6EG-1FFVB1156E ECAD Model
XCZU6EG-1FFVB1156E Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Surface Mount | YES | |
Supply Voltage-Nom | 850 mV | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
Technology | CMOS | |
Supply Voltage-Max | 876 mV | |
Supply Voltage-Min | 825 mV | |
Temperature Grade | OTHER | |
JESD-30 Code | R-PBGA-B1156 | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 100 °C | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1156 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Position | BOTTOM | |
Ihs Manufacturer | XILINX INC | |
Package Description | BGA, BGA1156,34X34,40 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A002.A.4 | |
HTS Code | 8542.39.00.01 |
XCZU6EG-1FFVB1156E Datasheet Download
XCZU6EG-1FFVB1156E Overview
The XCZU6EG-1FFVB1156E chip model is an advanced integrated circuit (IC) designed to meet the needs of modern communication systems. It is a high-performance, low-power device that offers a wide range of features and functions. With its high-speed data processing capabilities, it is capable of supporting multiple applications in the field of communication.
The XCZU6EG-1FFVB1156E chip model was designed with the intention of providing a reliable and efficient solution for communication networks. It is capable of supporting multiple applications such as voice, video, and data transmission. It offers a wide range of features and functions that make it suitable for use in advanced communication systems. It has a high-speed data processing capability and can be used for applications such as high-speed data transfer and multimedia streaming.
The XCZU6EG-1FFVB1156E chip model is suitable for use in the era of fully intelligent systems. It offers a wide range of features and functions that make it suitable for use in advanced communication networks. It supports a variety of intelligent scenarios such as voice recognition, facial recognition, image processing, and machine learning. It also offers a wide range of features and functions that make it suitable for use in the era of fully intelligent systems.
The XCZU6EG-1FFVB1156E chip model has been designed to meet specific design requirements. It has a wide range of features and functions that make it suitable for use in communication networks. It offers a high-speed data processing capability and can be used for applications such as high-speed data transfer and multimedia streaming. It also has a low power consumption and is capable of supporting multiple applications in the field of communication.
In addition, the XCZU6EG-1FFVB1156E chip model is capable of being upgraded in the future. It offers a wide range of features and functions that make it suitable for use in advanced communication systems. It is also capable of being used in the era of fully intelligent systems. Furthermore, actual case studies and precautions must be taken into account when using this chip model.
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3,344 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $1,638.9799 | $1,638.9799 |
10+ | $1,621.3565 | $16,213.5648 |
100+ | $1,533.2393 | $153,323.9280 |
1000+ | $1,445.1221 | $722,561.0400 |
10000+ | $1,321.7580 | $1,321,758.0000 |
The price is for reference only, please refer to the actual quotation! |