AMD Xilinx
XCZU6CG-L2FFVC900E
XCZU6CG-L2FFVC900E ECAD Model
XCZU6CG-L2FFVC900E Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 720 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Additional Feature | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | |
| Supply Voltage-Max | 742 mV | |
| Supply Voltage-Min | 698 mV | |
| Temperature Grade | OTHER | |
| JESD-30 Code | R-PBGA-B900 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 110 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 900 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, BGA900,30X30,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 |
XCZU6CG-L2FFVC900E Datasheet Download
XCZU6CG-L2FFVC900E Overview
The chip model XCZU6CG-L2FFVC900E is a cutting-edge product from the semiconductor industry. It is a powerful and versatile chip that can be used for a variety of applications. It is designed to meet the needs of the most demanding applications, from high-performance computing to embedded systems.
The XCZU6CG-L2FFVC900E chip is based on the Xilinx Zynq UltraScale+ MPSoC architecture. It features a quad-core ARM Cortex-A53 processor, a Mali-400 MP2 GPU, and an FPGA fabric that can be used to implement custom hardware accelerators. This combination of features makes it suitable for a wide range of applications, from high-performance computing to embedded systems.
The chip model XCZU6CG-L2FFVC900E is a highly flexible device that can be used to develop a variety of applications. It is suitable for high-performance computing applications such as image processing, machine learning, and artificial intelligence. It is also suitable for embedded systems such as industrial automation, robotics, and autonomous vehicles.
In terms of industry trends, the chip model XCZU6CG-L2FFVC900E is expected to be widely used in the future. With the increasing demand for intelligent robots and autonomous vehicles, the chip model XCZU6CG-L2FFVC900E can provide the necessary computing power and flexibility for these applications.
In order to use the chip model XCZU6CG-L2FFVC900E effectively, technical talent with knowledge of the Xilinx Zynq UltraScale+ MPSoC architecture and embedded systems programming is required. It is important to understand the product description and design requirements of the chip model, as well as to be aware of the potential pitfalls and precautions.
To conclude, the chip model XCZU6CG-L2FFVC900E is a powerful and versatile chip that can be used for a variety of applications. It is expected to be widely used in the future, and the technical talent with knowledge of the Xilinx Zynq UltraScale+ MPSoC architecture and embedded systems programming is required in order to use the chip model effectively.
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5,369 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $2,145.0413 | $2,145.0413 |
| 10+ | $2,121.9763 | $21,219.7632 |
| 100+ | $2,006.6515 | $200,665.1520 |
| 1000+ | $1,891.3267 | $945,663.3600 |
| 10000+ | $1,729.8720 | $1,729,872.0000 |
| The price is for reference only, please refer to the actual quotation! | ||