AMD Xilinx
XCZU6CG-2FFVC900E
XCZU6CG-2FFVC900E ECAD Model
XCZU6CG-2FFVC900E Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 850 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Supply Voltage-Max | 876 mV | |
| Supply Voltage-Min | 825 mV | |
| Temperature Grade | OTHER | |
| JESD-30 Code | R-PBGA-B900 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 900 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Seated Height-Max | 3.42 mm | |
| Width | 31 mm | |
| Length | 31 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, BGA900,30X30,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 | |
| Date Of Intro | 2017-02-15 |
XCZU6CG-2FFVC900E Datasheet Download
XCZU6CG-2FFVC900E Overview
The XCZU6CG-2FFVC900E chip model is a revolutionary new technology in the field of digital signal processing, embedded processing, and image processing. It is designed to provide high performance, long-term reliability, and low power consumption. This chip model is designed to be used with the HDL (Hardware Description Language) language, making it a powerful tool for engineers and developers alike.
The XCZU6CG-2FFVC900E model is also designed to be highly customizable, allowing it to be used in a variety of applications. This model is ideal for applications that require high-performance digital signal processing, embedded processing, and image processing. Additionally, the chip model is designed to be very reliable, allowing it to be used in mission-critical applications.
The XCZU6CG-2FFVC900E chip model is becoming increasingly popular in the industry, and its demand is expected to increase in the future. This is due to its high performance, low power consumption, and reliability. Additionally, the chip model is designed to be compatible with a variety of technologies, allowing it to be used in a variety of applications.
The XCZU6CG-2FFVC900E chip model is a great choice for engineers and developers who are looking for a reliable, high-performance solution for their digital signal processing, embedded processing, and image processing needs. This chip model is designed to be highly customizable and compatible with a variety of technologies, making it a great choice for a variety of applications. Additionally, its low power consumption and reliability make it a great choice for mission-critical applications.
As technology advances, the XCZU6CG-2FFVC900E chip model will become increasingly popular in the industry. Its demand is expected to increase in the future due to its high performance, low power consumption, and reliability. Additionally, its compatibility with a variety of technologies makes it a great choice for a variety of applications. Therefore, it is likely that the XCZU6CG-2FFVC900E chip model will become increasingly popular in the industry in the future, and its demand will increase accordingly.
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5,781 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,876.9111 | $1,876.9111 |
| 10+ | $1,856.7293 | $18,567.2928 |
| 100+ | $1,755.8201 | $175,582.0080 |
| 1000+ | $1,654.9109 | $827,455.4400 |
| 10000+ | $1,513.6380 | $1,513,638.0000 |
| The price is for reference only, please refer to the actual quotation! | ||