AMD Xilinx
XCZU6CG-1FFVC900I
XCZU6CG-1FFVC900I ECAD Model
XCZU6CG-1FFVC900I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 850 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Supply Voltage-Max | 876 mV | |
| Supply Voltage-Min | 825 mV | |
| Temperature Grade | INDUSTRIAL | |
| JESD-30 Code | R-PBGA-B900 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 900 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, BGA900,30X30,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 |
XCZU6CG-1FFVC900I Datasheet Download
XCZU6CG-1FFVC900I Overview
The XCZU6CG-1FFVC900I chip model has become the go-to for high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language, making it an ideal choice for those in the industry who require a powerful and flexible solution.
The advantages of the XCZU6CG-1FFVC900I chip model are numerous. It is capable of handling complex tasks with ease, thanks to its advanced architecture and powerful processing capabilities. It also offers a wide range of features, such as advanced memory management, high-speed I/O, and low power consumption. It is also highly reliable, with a long lifespan and low maintenance costs.
The demand for the XCZU6CG-1FFVC900I chip model is expected to grow in the coming years, as more industries require its processing power and flexibility. In addition to its current applications, the chip model is also expected to be used in more complex scenarios, such as networks and intelligent systems. It can be used to power fully intelligent systems, allowing for more efficient data processing and communication.
The XCZU6CG-1FFVC900I chip model is a powerful and reliable solution that is sure to be in high demand in the future. Its advanced architecture and powerful processing capabilities make it an ideal choice for those in the industry who require a powerful and flexible solution. With its wide range of features and applications, it is sure to be an invaluable asset in the years to come.
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1,856 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,675.5847 | $1,675.5847 |
| 10+ | $1,657.5677 | $16,575.6768 |
| 100+ | $1,567.4825 | $156,748.2480 |
| 1000+ | $1,477.3973 | $738,698.6400 |
| 10000+ | $1,351.2780 | $1,351,278.0000 |
| The price is for reference only, please refer to the actual quotation! | ||