
AMD Xilinx
XCZU6CG-1FFVB1156I
XCZU6CG-1FFVB1156I ECAD Model
XCZU6CG-1FFVB1156I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Surface Mount | YES | |
Supply Voltage-Nom | 850 mV | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
Technology | CMOS | |
Supply Voltage-Max | 876 mV | |
Supply Voltage-Min | 825 mV | |
Temperature Grade | INDUSTRIAL | |
JESD-30 Code | R-PBGA-B1156 | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1156 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Position | BOTTOM | |
Ihs Manufacturer | XILINX INC | |
Package Description | BGA, BGA1156,34X34,40 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A002.A.4 | |
HTS Code | 8542.39.00.01 |
XCZU6CG-1FFVB1156I Datasheet Download
XCZU6CG-1FFVB1156I Overview
The XCZU6CG-1FFVB1156I chip model is a highly advanced, feature-rich solution for a variety of industries. It is designed to provide superior performance, scalability, and reliability to meet the needs of an ever-changing market. This chip model is designed to meet the demands of the modern network, providing high-speed data transfer and a wide range of features.
The XCZU6CG-1FFVB1156I chip model offers a number of advantages, including high-speed data transfer, low power consumption, and a wide range of features. The chip model is designed to provide superior performance, scalability, and reliability in a wide range of applications. It is also designed to be compatible with a variety of network protocols, allowing it to be used in a variety of scenarios.
The XCZU6CG-1FFVB1156I chip model is expected to see increasing demand in the future, as more industries adopt it for their needs. This chip model is ideal for applications in the Internet of Things (IoT), as it is designed to be compatible with a variety of network protocols. This chip model can also be used in intelligent scenarios, such as smart home applications and autonomous vehicles.
The product description of the XCZU6CG-1FFVB1156I chip model includes a wide range of features, such as high-speed data transfer, low power consumption, and a wide range of features. The chip model is designed to be compatible with a variety of network protocols, allowing it to be used in a variety of scenarios. It is also designed to be highly reliable, ensuring that data is transferred securely and quickly.
In addition to the product description, a number of case studies have been conducted on the XCZU6CG-1FFVB1156I chip model. These case studies have highlighted the advantages of the chip model, such as its ability to provide high-speed data transfer, low power consumption, and a wide range of features. The case studies have also highlighted potential areas of improvement, such as the need for additional security measures.
When considering the XCZU6CG-1FFVB1156I chip model for use in a network or intelligent scenario, there are a few precautions to keep in mind. It is important to ensure that the chip model is compatible with the network protocol being used, as well as the specific requirements of the application. Additionally, it is important to ensure that the chip model is secure, as any potential vulnerabilities could lead to data breaches.
In conclusion, the XCZU6CG-1FFVB1156I chip model is a highly advanced, feature-rich solution for a variety of industries. It is designed to provide superior performance, scalability, and reliability to meet the needs of an ever-changing market. This chip model is expected to see increasing demand in the future, as more industries adopt it for their needs. The product description and case studies have highlighted the advantages of the chip model, as well as potential areas of improvement. When considering the XCZU6CG-1FFVB1156I chip model for use in a network or intelligent scenario, it is important to ensure that the chip model is compatible with the network protocol being used, as well as the specific requirements of the application. Additionally, it is important to ensure that the chip model is secure, as any potential vulnerabilities could lead to data breaches.
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4,831 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $1,893.3833 | $1,893.3833 |
10+ | $1,873.0243 | $18,730.2432 |
100+ | $1,771.2295 | $177,122.9520 |
1000+ | $1,669.4347 | $834,717.3600 |
10000+ | $1,526.9220 | $1,526,922.0000 |
The price is for reference only, please refer to the actual quotation! |