XCZU6CG-1FFVB1156I
XCZU6CG-1FFVB1156I
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

AMD Xilinx

XCZU6CG-1FFVB1156I


XCZU6CG-1FFVB1156I
F20-XCZU6CG-1FFVB1156I
Active
CMOS, BGA, BGA1156,34X34,40
BGA, BGA1156,34X34,40

XCZU6CG-1FFVB1156I ECAD Model


Download the free Library Loader to convert this file for your ECAD Tool. Learn more about ECAD Model.

XCZU6CG-1FFVB1156I Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 850 mV
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Supply Voltage-Max 876 mV
Supply Voltage-Min 825 mV
Temperature Grade INDUSTRIAL
JESD-30 Code R-PBGA-B1156
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1156
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description BGA, BGA1156,34X34,40
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01

XCZU6CG-1FFVB1156I Datasheet Download


XCZU6CG-1FFVB1156I Overview



The XCZU6CG-1FFVB1156I chip model is a highly advanced, feature-rich solution for a variety of industries. It is designed to provide superior performance, scalability, and reliability to meet the needs of an ever-changing market. This chip model is designed to meet the demands of the modern network, providing high-speed data transfer and a wide range of features.


The XCZU6CG-1FFVB1156I chip model offers a number of advantages, including high-speed data transfer, low power consumption, and a wide range of features. The chip model is designed to provide superior performance, scalability, and reliability in a wide range of applications. It is also designed to be compatible with a variety of network protocols, allowing it to be used in a variety of scenarios.


The XCZU6CG-1FFVB1156I chip model is expected to see increasing demand in the future, as more industries adopt it for their needs. This chip model is ideal for applications in the Internet of Things (IoT), as it is designed to be compatible with a variety of network protocols. This chip model can also be used in intelligent scenarios, such as smart home applications and autonomous vehicles.


The product description of the XCZU6CG-1FFVB1156I chip model includes a wide range of features, such as high-speed data transfer, low power consumption, and a wide range of features. The chip model is designed to be compatible with a variety of network protocols, allowing it to be used in a variety of scenarios. It is also designed to be highly reliable, ensuring that data is transferred securely and quickly.


In addition to the product description, a number of case studies have been conducted on the XCZU6CG-1FFVB1156I chip model. These case studies have highlighted the advantages of the chip model, such as its ability to provide high-speed data transfer, low power consumption, and a wide range of features. The case studies have also highlighted potential areas of improvement, such as the need for additional security measures.


When considering the XCZU6CG-1FFVB1156I chip model for use in a network or intelligent scenario, there are a few precautions to keep in mind. It is important to ensure that the chip model is compatible with the network protocol being used, as well as the specific requirements of the application. Additionally, it is important to ensure that the chip model is secure, as any potential vulnerabilities could lead to data breaches.


In conclusion, the XCZU6CG-1FFVB1156I chip model is a highly advanced, feature-rich solution for a variety of industries. It is designed to provide superior performance, scalability, and reliability to meet the needs of an ever-changing market. This chip model is expected to see increasing demand in the future, as more industries adopt it for their needs. The product description and case studies have highlighted the advantages of the chip model, as well as potential areas of improvement. When considering the XCZU6CG-1FFVB1156I chip model for use in a network or intelligent scenario, it is important to ensure that the chip model is compatible with the network protocol being used, as well as the specific requirements of the application. Additionally, it is important to ensure that the chip model is secure, as any potential vulnerabilities could lead to data breaches.



4,831 In Stock


I want to buy

Unit Price: $2,035.896
The price is for reference only.
paypal mastercard unionpay dhl fedex ups

Pricing (USD)

QTY Unit Price Ext Price
1+ $1,893.3833 $1,893.3833
10+ $1,873.0243 $18,730.2432
100+ $1,771.2295 $177,122.9520
1000+ $1,669.4347 $834,717.3600
10000+ $1,526.9220 $1,526,922.0000
The price is for reference only, please refer to the actual quotation!

Quick Quote