XCZU6CG-1FFVB1156E
XCZU6CG-1FFVB1156E
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AMD Xilinx

XCZU6CG-1FFVB1156E


XCZU6CG-1FFVB1156E
F20-XCZU6CG-1FFVB1156E
Active
CMOS, BGA, BGA1156,34X34,40
BGA, BGA1156,34X34,40

XCZU6CG-1FFVB1156E ECAD Model


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XCZU6CG-1FFVB1156E Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 850 mV
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Supply Voltage-Max 876 mV
Supply Voltage-Min 825 mV
Temperature Grade OTHER
JESD-30 Code R-PBGA-B1156
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1156
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description BGA, BGA1156,34X34,40
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01

XCZU6CG-1FFVB1156E Datasheet Download


XCZU6CG-1FFVB1156E Overview



The XCZU6CG-1FFVB1156E chip is a powerful and versatile solution for a variety of applications. Developed by Xilinx, this chip model was designed with the intention of providing users with the flexibility to customize their designs and to easily upgrade their systems. It is a field-programmable gate array (FPGA) that can be used in a variety of advanced communication systems.


The XCZU6CG-1FFVB1156E has a number of features that make it an ideal choice for applications in networks. It is capable of supporting high-speed data transmission, and its high-performance architecture ensures that it can handle complex data processing tasks. Additionally, it is designed to be highly reliable and secure, making it suitable for use in mission-critical applications.


The XCZU6CG-1FFVB1156E has the potential to be used in a wide range of intelligent scenarios. It can be used for machine learning and artificial intelligence, as well as for the creation of autonomous systems. It can also be used for the development of automated systems for various industries, such as manufacturing, transportation, and healthcare.


The XCZU6CG-1FFVB1156E chip is designed to meet the specific requirements of each customer. It is highly configurable and can be tailored to meet the needs of different applications. Additionally, it is designed to be easy to upgrade and can be used in the era of fully intelligent systems.


To ensure that the chip meets the desired requirements, Xilinx has conducted a number of case studies and tests. These tests have resulted in a number of recommendations and precautions that should be taken when using the XCZU6CG-1FFVB1156E chip. These include the use of appropriate cooling solutions, the use of appropriate power supplies, and the use of appropriate software and hardware configurations.


In conclusion, the XCZU6CG-1FFVB1156E chip is a powerful and versatile solution for a variety of applications. It is capable of supporting high-speed data transmission, and its high-performance architecture ensures that it can handle complex data processing tasks. Additionally, it is designed to be highly reliable and secure, making it suitable for use in mission-critical applications. It can also be used for the development of automated systems for various industries, and it is designed to be easy to upgrade and can be used in the era of fully intelligent systems. Xilinx has conducted a number of case studies and tests to ensure that the chip meets the desired requirements, and a number of recommendations and precautions should be taken when using the XCZU6CG-1FFVB1156E chip.



5,432 In Stock


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Unit Price: $1,628.52
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $1,514.5236 $1,514.5236
10+ $1,498.2384 $14,982.3840
100+ $1,416.8124 $141,681.2400
1000+ $1,335.3864 $667,693.2000
10000+ $1,221.3900 $1,221,390.0000
The price is for reference only, please refer to the actual quotation!

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