
AMD Xilinx
XCZU5EV-L2FBVB900E
XCZU5EV-L2FBVB900E ECAD Model
XCZU5EV-L2FBVB900E Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Surface Mount | YES | |
Supply Voltage-Nom | 720 mV | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
Technology | CMOS | |
Additional Feature | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | |
Supply Voltage-Max | 742 mV | |
Supply Voltage-Min | 698 mV | |
Temperature Grade | OTHER | |
JESD-30 Code | R-PBGA-B900 | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 110 °C | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 900 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Position | BOTTOM | |
Ihs Manufacturer | XILINX INC | |
Package Description | BGA, BGA900,30X30,40 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A002.A.4 | |
HTS Code | 8542.39.00.01 |
XCZU5EV-L2FBVB900E Datasheet Download
XCZU5EV-L2FBVB900E Overview
The chip model XCZU5EV-L2FBVB900E is a product of Xilinx, Inc., a leading developer of programmable logic devices (PLDs). It is a highly integrated multi-processor system-on-chip (MPSoC) with a high-speed interconnect and a variety of embedded memory blocks. It is designed to provide high-performance, low-power computing solutions for embedded systems.
The XCZU5EV-L2FBVB900E is based on the Xilinx Zynq UltraScale+ MPSoC architecture, which combines a quad-core ARM Cortex-A53 application processor, a dual-core ARM Cortex-R5 real-time processor, a Mali-400 GPU, and an UltraRAM memory controller. It also includes a variety of peripherals and I/O interfaces, such as USB, Ethernet, and PCIe. The chip model is suitable for a wide range of applications, including industrial automation, automotive, medical, and consumer electronics.
The XCZU5EV-L2FBVB900E is designed to be highly extensible and customizable. It supports the latest technologies, such as artificial intelligence (AI), machine learning (ML), and 5G communications. It is also designed to be upgradeable, so that new features and technologies can be added as they become available.
The XCZU5EV-L2FBVB900E can be used in the development and popularization of future intelligent robots. It is an ideal platform for AI-powered robots, as it has the necessary processing power and memory to support sophisticated AI algorithms. It also supports real-time processing, which is essential for robotic control systems.
In order to use the XCZU5EV-L2FBVB900E effectively, technical talents with knowledge of embedded systems, AI, and robotics are needed. They must be able to design and develop software and hardware solutions for the chip model, as well as integrate it with other components.
The XCZU5EV-L2FBVB900E is a powerful and versatile chip model that can be used in a variety of applications. It is designed to be upgradeable and extensible, so that it can keep up with the latest industry trends and technologies. With the right technical talent, it can be used to develop and popularize future intelligent robots.
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2,050 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $2,246.6196 | $2,246.6196 |
10+ | $2,222.4624 | $22,224.6240 |
100+ | $2,101.6764 | $210,167.6400 |
1000+ | $1,980.8904 | $990,445.2000 |
10000+ | $1,811.7900 | $1,811,790.0000 |
The price is for reference only, please refer to the actual quotation! |