XCZU5EV-L2FBVB900E
XCZU5EV-L2FBVB900E
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

AMD Xilinx

XCZU5EV-L2FBVB900E


XCZU5EV-L2FBVB900E
F20-XCZU5EV-L2FBVB900E
Active
CMOS, BGA, BGA900,30X30,40
BGA, BGA900,30X30,40

XCZU5EV-L2FBVB900E ECAD Model


Download the free Library Loader to convert this file for your ECAD Tool. Learn more about ECAD Model.

XCZU5EV-L2FBVB900E Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 720 mV
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Additional Feature ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
Supply Voltage-Max 742 mV
Supply Voltage-Min 698 mV
Temperature Grade OTHER
JESD-30 Code R-PBGA-B900
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 110 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 900
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description BGA, BGA900,30X30,40
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01

XCZU5EV-L2FBVB900E Datasheet Download


XCZU5EV-L2FBVB900E Overview



The chip model XCZU5EV-L2FBVB900E is a product of Xilinx, Inc., a leading developer of programmable logic devices (PLDs). It is a highly integrated multi-processor system-on-chip (MPSoC) with a high-speed interconnect and a variety of embedded memory blocks. It is designed to provide high-performance, low-power computing solutions for embedded systems.


The XCZU5EV-L2FBVB900E is based on the Xilinx Zynq UltraScale+ MPSoC architecture, which combines a quad-core ARM Cortex-A53 application processor, a dual-core ARM Cortex-R5 real-time processor, a Mali-400 GPU, and an UltraRAM memory controller. It also includes a variety of peripherals and I/O interfaces, such as USB, Ethernet, and PCIe. The chip model is suitable for a wide range of applications, including industrial automation, automotive, medical, and consumer electronics.


The XCZU5EV-L2FBVB900E is designed to be highly extensible and customizable. It supports the latest technologies, such as artificial intelligence (AI), machine learning (ML), and 5G communications. It is also designed to be upgradeable, so that new features and technologies can be added as they become available.


The XCZU5EV-L2FBVB900E can be used in the development and popularization of future intelligent robots. It is an ideal platform for AI-powered robots, as it has the necessary processing power and memory to support sophisticated AI algorithms. It also supports real-time processing, which is essential for robotic control systems.


In order to use the XCZU5EV-L2FBVB900E effectively, technical talents with knowledge of embedded systems, AI, and robotics are needed. They must be able to design and develop software and hardware solutions for the chip model, as well as integrate it with other components.


The XCZU5EV-L2FBVB900E is a powerful and versatile chip model that can be used in a variety of applications. It is designed to be upgradeable and extensible, so that it can keep up with the latest industry trends and technologies. With the right technical talent, it can be used to develop and popularize future intelligent robots.



2,050 In Stock


I want to buy

Unit Price: $2,415.72
The price is for reference only.
paypal mastercard unionpay dhl fedex ups

Pricing (USD)

QTY Unit Price Ext Price
1+ $2,246.6196 $2,246.6196
10+ $2,222.4624 $22,224.6240
100+ $2,101.6764 $210,167.6400
1000+ $1,980.8904 $990,445.2000
10000+ $1,811.7900 $1,811,790.0000
The price is for reference only, please refer to the actual quotation!

Quick Quote