XCZU5EV-L1FBVB900I
XCZU5EV-L1FBVB900I
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

AMD Xilinx

XCZU5EV-L1FBVB900I


XCZU5EV-L1FBVB900I
F20-XCZU5EV-L1FBVB900I
Active
CMOS, BGA, BGA900,30X30,40
BGA, BGA900,30X30,40

XCZU5EV-L1FBVB900I ECAD Model


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XCZU5EV-L1FBVB900I Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 720 mV
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Additional Feature ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
Supply Voltage-Max 742 mV
Supply Voltage-Min 698 mV
Temperature Grade INDUSTRIAL
JESD-30 Code R-PBGA-B900
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 900
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description BGA, BGA900,30X30,40
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01

XCZU5EV-L1FBVB900I Datasheet Download


XCZU5EV-L1FBVB900I Overview



The Xilinx XCZU5EV-L1FBVB900I chip model is a powerful and versatile product that can be used in a variety of applications. It is a high-performance system-on-chip (SoC) with a dual-core Arm Cortex-A53 processor and a Mali-450 MP2 GPU. It is designed to provide high performance, low power consumption, and a wide range of features.


The XCZU5EV-L1FBVB900I chip model is designed to meet the needs of advanced communication systems. It is capable of supporting a wide range of communication protocols, including Ethernet, Wi-Fi, Bluetooth, and Zigbee. It also supports advanced security features such as secure boot, secure storage, and secure data transfer.


The XCZU5EV-L1FBVB900I chip model is designed to be highly configurable and upgradeable. It is designed to be flexible and adaptable, allowing for future upgrades and modifications. It is also designed to be highly reliable and efficient, with low power consumption and high performance.


The XCZU5EV-L1FBVB900I chip model is designed to meet the needs of the most demanding applications. It is capable of supporting a wide range of technologies, including artificial intelligence (AI), machine learning (ML), deep learning (DL), and other advanced technologies. It is also capable of supporting a variety of operating systems, including Linux, Android, and Windows.


When considering the application of the XCZU5EV-L1FBVB900I chip model, it is important to consider the industry trends and the future development of related industries. It is also important to consider the product description and specific design requirements for the chip model, as well as any actual case studies or precautions.


The future of the XCZU5EV-L1FBVB900I chip model is highly dependent on the industry trends and the future development of related industries. It is important to consider the product description and specific design requirements for the chip model, as well as any actual case studies or precautions. The XCZU5EV-L1FBVB900I chip model is designed to be highly configurable and upgradeable, allowing for future upgrades and modifications. It is also designed to be highly reliable and efficient, with low power consumption and high performance.


Overall, the XCZU5EV-L1FBVB900I chip model is a powerful and versatile product that can be used in a variety of applications. It is designed to meet the needs of the most demanding applications and is capable of supporting a wide range of technologies. It is also designed to be highly configurable and upgradeable, allowing for future upgrades and modifications. It is important to consider the industry trends and the future development of related industries, as well as the product description and specific design requirements for the chip model, when considering the application of the XCZU5EV-L1FBVB900I chip model.



1,232 In Stock


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Unit Price: $2,113.632
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $1,965.6778 $1,965.6778
10+ $1,944.5414 $19,445.4144
100+ $1,838.8598 $183,885.9840
1000+ $1,733.1782 $866,589.1200
10000+ $1,585.2240 $1,585,224.0000
The price is for reference only, please refer to the actual quotation!

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