XCZU5EV-3SFVC784E
XCZU5EV-3SFVC784E
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rohs

AMD Xilinx

XCZU5EV-3SFVC784E


XCZU5EV-3SFVC784E
F20-XCZU5EV-3SFVC784E
Active
CMOS, FBGA, BGA78428X28,32
FBGA, BGA78428X28,32

XCZU5EV-3SFVC784E ECAD Model


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XCZU5EV-3SFVC784E Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 900 mV
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Temperature Grade OTHER
JESD-30 Code S-PBGA-B784
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 784
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description FBGA, BGA78428X28,32
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01

XCZU5EV-3SFVC784E Datasheet Download


XCZU5EV-3SFVC784E Overview



The XCZU5EV-3SFVC784E chip model is a new development in the field of integrated circuit technology. It is a high-performance, low-power, ultra-high-density, multi-core chip solution with a wide range of application potential. This model is designed to meet the needs of high-speed, multi-core computing and data processing, as well as advanced communication systems.


The XCZU5EV-3SFVC784E chip model has several advantages that set it apart from other chip models. It has a low power consumption and a high level of integration, which makes it a cost-effective solution for many applications. It also has a high performance-to-power ratio, and its multi-core architecture allows for greater scalability. In addition, the model supports a wide range of peripherals and can be used in various applications.


The XCZU5EV-3SFVC784E chip model is expected to have a great demand in the future. Its high performance and low power consumption make it an ideal solution for many applications, such as artificial intelligence, robotics, and the Internet of Things. Its multi-core architecture also makes it suitable for a wide range of tasks, from embedded systems to high-end computing.


The XCZU5EV-3SFVC784E chip model has the potential to be upgraded in the future. Its high performance and scalability make it a suitable platform for future upgrades. It can be used in advanced communication systems such as 5G and Wi-Fi 6, as well as in data processing, artificial intelligence, and robotics. Furthermore, the model can be used in the development and popularization of future intelligent robots.


To use the XCZU5EV-3SFVC784E chip model effectively, a combination of technical talents is needed. This includes engineers and technicians with expertise in integrated circuit design, embedded systems, and artificial intelligence. Furthermore, developers and designers with knowledge of robotics and the Internet of Things are also necessary to make the most of this model.


In conclusion, the XCZU5EV-3SFVC784E chip model is a powerful and versatile solution for many applications. Its low power consumption, high performance, and scalability make it a great choice for future upgrades. It can be used in advanced communication systems, data processing, artificial intelligence, and robotics. Furthermore, the model requires a combination of technical talents to use it effectively.



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Unit Price: $9,281.5099
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Pricing (USD)

QTY Unit Price Ext Price
1+ $8,631.8042 $8,631.8042
10+ $8,538.9891 $85,389.8911
100+ $8,074.9136 $807,491.3613
1000+ $7,610.8381 $3,805,419.0590
10000+ $6,961.1324 $6,961,132.4250
The price is for reference only, please refer to the actual quotation!

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