
AMD Xilinx
XCZU5EV-3SFVC784E
XCZU5EV-3SFVC784E ECAD Model
XCZU5EV-3SFVC784E Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Surface Mount | YES | |
Supply Voltage-Nom | 900 mV | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
Technology | CMOS | |
Temperature Grade | OTHER | |
JESD-30 Code | S-PBGA-B784 | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 100 °C | |
Peak Reflow Temperature (Cel) | 250 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 784 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Position | BOTTOM | |
Ihs Manufacturer | XILINX INC | |
Package Description | FBGA, BGA78428X28,32 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A002.A.4 | |
HTS Code | 8542.39.00.01 |
XCZU5EV-3SFVC784E Datasheet Download
XCZU5EV-3SFVC784E Overview
The XCZU5EV-3SFVC784E chip model is a new development in the field of integrated circuit technology. It is a high-performance, low-power, ultra-high-density, multi-core chip solution with a wide range of application potential. This model is designed to meet the needs of high-speed, multi-core computing and data processing, as well as advanced communication systems.
The XCZU5EV-3SFVC784E chip model has several advantages that set it apart from other chip models. It has a low power consumption and a high level of integration, which makes it a cost-effective solution for many applications. It also has a high performance-to-power ratio, and its multi-core architecture allows for greater scalability. In addition, the model supports a wide range of peripherals and can be used in various applications.
The XCZU5EV-3SFVC784E chip model is expected to have a great demand in the future. Its high performance and low power consumption make it an ideal solution for many applications, such as artificial intelligence, robotics, and the Internet of Things. Its multi-core architecture also makes it suitable for a wide range of tasks, from embedded systems to high-end computing.
The XCZU5EV-3SFVC784E chip model has the potential to be upgraded in the future. Its high performance and scalability make it a suitable platform for future upgrades. It can be used in advanced communication systems such as 5G and Wi-Fi 6, as well as in data processing, artificial intelligence, and robotics. Furthermore, the model can be used in the development and popularization of future intelligent robots.
To use the XCZU5EV-3SFVC784E chip model effectively, a combination of technical talents is needed. This includes engineers and technicians with expertise in integrated circuit design, embedded systems, and artificial intelligence. Furthermore, developers and designers with knowledge of robotics and the Internet of Things are also necessary to make the most of this model.
In conclusion, the XCZU5EV-3SFVC784E chip model is a powerful and versatile solution for many applications. Its low power consumption, high performance, and scalability make it a great choice for future upgrades. It can be used in advanced communication systems, data processing, artificial intelligence, and robotics. Furthermore, the model requires a combination of technical talents to use it effectively.
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5,694 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $8,631.8042 | $8,631.8042 |
10+ | $8,538.9891 | $85,389.8911 |
100+ | $8,074.9136 | $807,491.3613 |
1000+ | $7,610.8381 | $3,805,419.0590 |
10000+ | $6,961.1324 | $6,961,132.4250 |
The price is for reference only, please refer to the actual quotation! |