XCZU5EV-3FBVB900E
XCZU5EV-3FBVB900E
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rohs

AMD Xilinx

XCZU5EV-3FBVB900E


XCZU5EV-3FBVB900E
F20-XCZU5EV-3FBVB900E
Active
CMOS, BGA, BGA900,30X30,40
BGA, BGA900,30X30,40

XCZU5EV-3FBVB900E ECAD Model


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XCZU5EV-3FBVB900E Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 900 mV
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Supply Voltage-Max 927 mV
Supply Voltage-Min 873 mV
Temperature Grade OTHER
JESD-30 Code R-PBGA-B900
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 900
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description BGA, BGA900,30X30,40
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01

XCZU5EV-3FBVB900E Datasheet Download


XCZU5EV-3FBVB900E Overview



The chip model XCZU5EV-3FBVB900E is a high-performance, cost-effective system-on-chip (SoC) designed for embedded applications. It has a wide range of features and capabilities, including a dual-core Arm Cortex-A53 processor, an FPGA fabric, and a high-performance, low-power DDR3 memory controller. The XCZU5EV-3FBVB900E is ideal for applications that require high-performance, low-power, and cost-effective solutions.


The XCZU5EV-3FBVB900E is expected to be in high demand in the coming years, as it can provide a cost-effective solution for a variety of embedded applications. It is also expected to be widely used in industrial, automotive, and consumer electronics applications, as well as in the Internet of Things (IoT). As the demand for intelligent applications continues to grow, the XCZU5EV-3FBVB900E is expected to be the go-to chip for many applications.


The XCZU5EV-3FBVB900E is also expected to be used in networks, as it can provide a high-speed connection between devices. It can also be used in intelligent scenarios, such as facial recognition, autonomous driving, and industrial automation. As the demand for intelligent applications increases, the XCZU5EV-3FBVB900E is expected to be the ideal choice for many applications.


The XCZU5EV-3FBVB900E is expected to be the go-to chip for many applications in the future, as it can provide a cost-effective solution for a variety of embedded applications. It is also expected to be widely used in networks and intelligent scenarios, such as facial recognition, autonomous driving, and industrial automation. With the development of new technologies, the XCZU5EV-3FBVB900E is expected to be the ideal choice for many applications in the era of fully intelligent systems.



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Unit Price: $2,944.128
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $2,738.0390 $2,738.0390
10+ $2,708.5978 $27,085.9776
100+ $2,561.3914 $256,139.1360
1000+ $2,414.1850 $1,207,092.4800
10000+ $2,208.0960 $2,208,096.0000
The price is for reference only, please refer to the actual quotation!

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