
AMD Xilinx
XCZU5EV-3FBVB900E
XCZU5EV-3FBVB900E ECAD Model
XCZU5EV-3FBVB900E Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Surface Mount | YES | |
Supply Voltage-Nom | 900 mV | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
Technology | CMOS | |
Supply Voltage-Max | 927 mV | |
Supply Voltage-Min | 873 mV | |
Temperature Grade | OTHER | |
JESD-30 Code | R-PBGA-B900 | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 100 °C | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 900 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Position | BOTTOM | |
Ihs Manufacturer | XILINX INC | |
Package Description | BGA, BGA900,30X30,40 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A002.A.4 | |
HTS Code | 8542.39.00.01 |
XCZU5EV-3FBVB900E Datasheet Download
XCZU5EV-3FBVB900E Overview
The chip model XCZU5EV-3FBVB900E is a high-performance, cost-effective system-on-chip (SoC) designed for embedded applications. It has a wide range of features and capabilities, including a dual-core Arm Cortex-A53 processor, an FPGA fabric, and a high-performance, low-power DDR3 memory controller. The XCZU5EV-3FBVB900E is ideal for applications that require high-performance, low-power, and cost-effective solutions.
The XCZU5EV-3FBVB900E is expected to be in high demand in the coming years, as it can provide a cost-effective solution for a variety of embedded applications. It is also expected to be widely used in industrial, automotive, and consumer electronics applications, as well as in the Internet of Things (IoT). As the demand for intelligent applications continues to grow, the XCZU5EV-3FBVB900E is expected to be the go-to chip for many applications.
The XCZU5EV-3FBVB900E is also expected to be used in networks, as it can provide a high-speed connection between devices. It can also be used in intelligent scenarios, such as facial recognition, autonomous driving, and industrial automation. As the demand for intelligent applications increases, the XCZU5EV-3FBVB900E is expected to be the ideal choice for many applications.
The XCZU5EV-3FBVB900E is expected to be the go-to chip for many applications in the future, as it can provide a cost-effective solution for a variety of embedded applications. It is also expected to be widely used in networks and intelligent scenarios, such as facial recognition, autonomous driving, and industrial automation. With the development of new technologies, the XCZU5EV-3FBVB900E is expected to be the ideal choice for many applications in the era of fully intelligent systems.
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Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $2,738.0390 | $2,738.0390 |
10+ | $2,708.5978 | $27,085.9776 |
100+ | $2,561.3914 | $256,139.1360 |
1000+ | $2,414.1850 | $1,207,092.4800 |
10000+ | $2,208.0960 | $2,208,096.0000 |
The price is for reference only, please refer to the actual quotation! |