AMD Xilinx
XCZU5EV-2FBVB900E
XCZU5EV-2FBVB900E ECAD Model
XCZU5EV-2FBVB900E Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 850 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Supply Voltage-Max | 876 mV | |
| Supply Voltage-Min | 825 mV | |
| Temperature Grade | OTHER | |
| JESD-30 Code | R-PBGA-B900 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 900 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Seated Height-Max | 2.88 mm | |
| Width | 31 mm | |
| Length | 31 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, BGA900,30X30,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 | |
| Date Of Intro | 2017-02-15 |
XCZU5EV-2FBVB900E Datasheet Download
XCZU5EV-2FBVB900E Overview
The XCZU5EV-2FBVB900E chip model is a high-performance, low-power integrated circuit designed to meet the needs of a wide range of applications. It is suitable for use in high-performance digital signal processing, embedded processing, and image processing, requiring the use of HDL language. This chip model has several advantages that make it a great choice for these applications.
The XCZU5EV-2FBVB900E chip model is designed to be highly efficient and cost-effective, with a low power consumption and low heat dissipation. It is also designed to be highly reliable and robust, with a long life cycle and minimal maintenance requirements. Additionally, the XCZU5EV-2FBVB900E chip model is designed to be highly scalable, allowing it to be used in a variety of applications and to be upgraded as needed.
The XCZU5EV-2FBVB900E chip model is expected to be in high demand in related industries in the future. This is due to the chip model's versatility and scalability, as well as its cost-effectiveness and reliability. Additionally, the XCZU5EV-2FBVB900E chip model is designed to be easily upgradeable, allowing it to keep up with the latest advances in technology.
The original design intention of the XCZU5EV-2FBVB900E chip model was to provide a high-performance, low-power integrated circuit that could be used in a wide range of applications. It was designed to be highly reliable and robust, with a long life cycle and minimal maintenance requirements. Additionally, the XCZU5EV-2FBVB900E chip model was designed to be highly scalable, allowing it to be used in a variety of applications and to be upgraded as needed.
The XCZU5EV-2FBVB900E chip model is capable of being upgraded to meet the needs of advanced communication systems. This is due to the chip model's scalability and versatility, as well as its cost-effectiveness and reliability. Additionally, the XCZU5EV-2FBVB900E chip model is designed to be easily upgradeable, allowing it to keep up with the latest advances in technology. This makes it a great choice for advanced communication systems, as it can be easily adapted to meet the needs of the system.
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2,546 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,965.6778 | $1,965.6778 |
| 10+ | $1,944.5414 | $19,445.4144 |
| 100+ | $1,838.8598 | $183,885.9840 |
| 1000+ | $1,733.1782 | $866,589.1200 |
| 10000+ | $1,585.2240 | $1,585,224.0000 |
| The price is for reference only, please refer to the actual quotation! | ||