XCZU5EV-1SFVC784E
XCZU5EV-1SFVC784E
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rohs

AMD Xilinx

XCZU5EV-1SFVC784E


XCZU5EV-1SFVC784E
F20-XCZU5EV-1SFVC784E
Active
CMOS, FBGA, BGA78428X28,32
FBGA, BGA78428X28,32

XCZU5EV-1SFVC784E ECAD Model


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XCZU5EV-1SFVC784E Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 850 mV
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Supply Voltage-Max 876 mV
Supply Voltage-Min 825 mV
Temperature Grade OTHER
JESD-30 Code R-PBGA-B784
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 784
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description FBGA, BGA78428X28,32
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01

XCZU5EV-1SFVC784E Datasheet Download


XCZU5EV-1SFVC784E Overview



The XCZU5EV-1SFVC784E chip model is a high-performance integrated circuit that can be used for a variety of applications, from digital signal processing to embedded processing and image processing. It is designed to be used with the HDL (Hardware Description Language) programming language, allowing for a more efficient and reliable design process.


The XCZU5EV-1SFVC784E chip model has several advantages over its competitors, including its high-speed data processing capabilities and its low power consumption. It is also designed to be compatible with a wide range of hardware and software platforms, making it a great choice for applications that require flexibility and scalability. Additionally, the chip model is designed to be easily upgradable, allowing for future expansion and development.


The XCZU5EV-1SFVC784E chip model is expected to be in high demand in the coming years, as the demand for high-performance digital signal processing and embedded processing solutions continues to grow. It is likely that the chip model will be used in a variety of industries, including automotive, medical, and consumer electronics. Additionally, the chip model is expected to be used in a wide range of networks, such as 5G and IoT networks.


The XCZU5EV-1SFVC784E chip model is also likely to be used in a variety of intelligent scenarios, such as intelligent manufacturing and autonomous vehicles. Additionally, the chip model is expected to be used in the era of fully intelligent systems, as it is designed to be compatible with a wide range of hardware and software platforms. This makes it an ideal choice for applications that require flexibility and scalability.



3,215 In Stock


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Unit Price: $1,173.12
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $1,091.0016 $1,091.0016
10+ $1,079.2704 $10,792.7040
100+ $1,020.6144 $102,061.4400
1000+ $961.9584 $480,979.2000
10000+ $879.8400 $879,840.0000
The price is for reference only, please refer to the actual quotation!

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