XCZU5EV-1FBVB900I
XCZU5EV-1FBVB900I
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rohs

AMD Xilinx

XCZU5EV-1FBVB900I


XCZU5EV-1FBVB900I
F20-XCZU5EV-1FBVB900I
Active
CMOS, BGA, BGA900,30X30,40
BGA, BGA900,30X30,40

XCZU5EV-1FBVB900I ECAD Model


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XCZU5EV-1FBVB900I Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 850 mV
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Supply Voltage-Max 876 mV
Supply Voltage-Min 825 mV
Temperature Grade INDUSTRIAL
JESD-30 Code R-PBGA-B900
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 900
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description BGA, BGA900,30X30,40
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01

XCZU5EV-1FBVB900I Datasheet Download


XCZU5EV-1FBVB900I Overview



The chip model XCZU5EV-1FBVB900I is a powerful chip model developed by Xilinx, Inc. It is designed to meet the requirements of high-performance embedded computing and offers a wide range of features, such as a high-performance processor, a high-bandwidth memory controller, and a high-speed Ethernet interface. This chip model is suitable for a variety of applications, such as artificial intelligence, machine learning, and robotics.


The industry trends of the chip model XCZU5EV-1FBVB900I are constantly evolving, and the future of related industries will depend on the specific technologies needed. For example, the chip model is expected to support new technologies such as 5G, AI, and ML. These technologies are essential for the development and popularization of future intelligent robots.


When it comes to the product description and specific design requirements of the chip model XCZU5EV-1FBVB900I, it is important to note that the model has a wide range of features that make it suitable for many applications. For example, the model offers a high-performance processor, a high-bandwidth memory controller, and a high-speed Ethernet interface. In addition, the model is designed to be compatible with a variety of development boards, such as the Zynq UltraScale+ MPSoC.


When using the chip model XCZU5EV-1FBVB900I, it is important to consider the actual case studies and precautions. For example, when developing a system based on the chip model, it is important to consider the power budget and the thermal budget of the system. It is also important to consider the system architecture and the design of the system-level components.


Finally, when it comes to the application of the chip model XCZU5EV-1FBVB900I to the development and popularization of future intelligent robots, it is important to consider the technical talents needed to use the model effectively. For example, the model requires the use of advanced programming languages, such as C, C++, and Python. In addition, the model requires the use of advanced algorithms and techniques, such as deep learning, computer vision, and natural language processing. Therefore, it is important to have a team of experienced professionals who are familiar with the model and its features.



2,919 In Stock


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Unit Price: $1,887.312
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $1,755.2002 $1,755.2002
10+ $1,736.3270 $17,363.2704
100+ $1,641.9614 $164,196.1440
1000+ $1,547.5958 $773,797.9200
10000+ $1,415.4840 $1,415,484.0000
The price is for reference only, please refer to the actual quotation!

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