
AMD Xilinx
XCZU5EG-3FBVB900E
XCZU5EG-3FBVB900E ECAD Model
XCZU5EG-3FBVB900E Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Surface Mount | YES | |
Supply Voltage-Nom | 900 mV | |
uPs/uCs/Peripheral ICs Type | PROGRAMMABLE SoC | |
Technology | CMOS | |
Supply Voltage-Max | 927 mV | |
Supply Voltage-Min | 873 mV | |
Temperature Grade | OTHER | |
JESD-30 Code | R-PBGA-B900 | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 100 °C | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 900 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA900,30X30,40 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Seated Height-Max | 2.88 mm | |
Width | 31 mm | |
Length | 31 mm | |
Ihs Manufacturer | XILINX INC | |
Package Description | BGA, BGA900,30X30,40 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A002.A.4 | |
HTS Code | 8542.39.00.01 |
XCZU5EG-3FBVB900E Datasheet Download
XCZU5EG-3FBVB900E Overview
The XCZU5EG-3FBVB900E chip model is an advanced integrated circuit developed by Xilinx, Inc. It is designed to provide high-performance and cost-effective solutions for a wide range of applications, including advanced communication systems. The chip model is based on a 28nm UltraScale+ FPGA architecture and is equipped with up to 900K logic cells, 10.3Mb of embedded memory and other features.
The XCZU5EG-3FBVB900E chip model is a powerful tool for developing and deploying advanced communications systems. It provides an efficient platform for the implementation of powerful algorithms, such as those used in 5G networks, and can support a variety of communication protocols. Furthermore, the chip model is also suitable for use in a wide range of intelligent scenarios, such as autonomous driving, robotics, facial recognition and machine learning.
The XCZU5EG-3FBVB900E chip model is also suitable for use in the development and popularization of future intelligent robots. Its high performance and cost-effective design make it an ideal choice for robotics applications. It can be used to implement sophisticated algorithms and protocols, as well as to control various components of a robot, such as motors, sensors and actuators. In order to use the chip model effectively, it is necessary to have a good understanding of the underlying architecture and the available features.
Overall, the XCZU5EG-3FBVB900E chip model is a powerful tool for the development and deployment of advanced communications systems and intelligent robots. Its advanced features and cost-effective design make it an ideal choice for a variety of applications. With the right technical knowledge and expertise, the chip model can be used to create powerful and efficient solutions for the development and popularization of future intelligent systems.
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5,108 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $10,841.9820 | $10,841.9820 |
10+ | $10,725.4016 | $107,254.0158 |
100+ | $10,142.4993 | $1,014,249.9324 |
1000+ | $9,559.5971 | $4,779,798.5320 |
10000+ | $8,743.5339 | $8,743,533.9000 |
The price is for reference only, please refer to the actual quotation! |