XCZU5EG-3FBVB900E
XCZU5EG-3FBVB900E
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rohs

AMD Xilinx

XCZU5EG-3FBVB900E


XCZU5EG-3FBVB900E
F20-XCZU5EG-3FBVB900E
Active
CMOS, BGA, BGA900,30X30,40
BGA, BGA900,30X30,40

XCZU5EG-3FBVB900E ECAD Model


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XCZU5EG-3FBVB900E Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 900 mV
uPs/uCs/Peripheral ICs Type PROGRAMMABLE SoC
Technology CMOS
Supply Voltage-Max 927 mV
Supply Voltage-Min 873 mV
Temperature Grade OTHER
JESD-30 Code R-PBGA-B900
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 900
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA900,30X30,40
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Seated Height-Max 2.88 mm
Width 31 mm
Length 31 mm
Ihs Manufacturer XILINX INC
Package Description BGA, BGA900,30X30,40
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01

XCZU5EG-3FBVB900E Datasheet Download


XCZU5EG-3FBVB900E Overview



The XCZU5EG-3FBVB900E chip model is an advanced integrated circuit developed by Xilinx, Inc. It is designed to provide high-performance and cost-effective solutions for a wide range of applications, including advanced communication systems. The chip model is based on a 28nm UltraScale+ FPGA architecture and is equipped with up to 900K logic cells, 10.3Mb of embedded memory and other features.


The XCZU5EG-3FBVB900E chip model is a powerful tool for developing and deploying advanced communications systems. It provides an efficient platform for the implementation of powerful algorithms, such as those used in 5G networks, and can support a variety of communication protocols. Furthermore, the chip model is also suitable for use in a wide range of intelligent scenarios, such as autonomous driving, robotics, facial recognition and machine learning.


The XCZU5EG-3FBVB900E chip model is also suitable for use in the development and popularization of future intelligent robots. Its high performance and cost-effective design make it an ideal choice for robotics applications. It can be used to implement sophisticated algorithms and protocols, as well as to control various components of a robot, such as motors, sensors and actuators. In order to use the chip model effectively, it is necessary to have a good understanding of the underlying architecture and the available features.


Overall, the XCZU5EG-3FBVB900E chip model is a powerful tool for the development and deployment of advanced communications systems and intelligent robots. Its advanced features and cost-effective design make it an ideal choice for a variety of applications. With the right technical knowledge and expertise, the chip model can be used to create powerful and efficient solutions for the development and popularization of future intelligent systems.



5,108 In Stock


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Unit Price: $11,658.0452
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $10,841.9820 $10,841.9820
10+ $10,725.4016 $107,254.0158
100+ $10,142.4993 $1,014,249.9324
1000+ $9,559.5971 $4,779,798.5320
10000+ $8,743.5339 $8,743,533.9000
The price is for reference only, please refer to the actual quotation!

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