AMD Xilinx
XCZU5EG-2FBVB900I
XCZU5EG-2FBVB900I ECAD Model
XCZU5EG-2FBVB900I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 850 mV | |
| uPs/uCs/Peripheral ICs Type | PROGRAMMABLE SoC | |
| Technology | CMOS | |
| Supply Voltage-Max | 876 mV | |
| Supply Voltage-Min | 825 mV | |
| Temperature Grade | INDUSTRIAL | |
| JESD-30 Code | R-PBGA-B900 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 900 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA900,30X30,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Seated Height-Max | 2.88 mm | |
| Width | 31 mm | |
| Length | 31 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, BGA900,30X30,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 |
XCZU5EG-2FBVB900I Datasheet Download
XCZU5EG-2FBVB900I Overview
The XCZU5EG-2FBVB900I chip model is a powerful and versatile tool for digital signal processing, embedded processing, and image processing. It is designed for use with HDL (Hardware Description Language) and is suitable for a wide range of applications. Its high-performance capabilities make it an ideal choice for a variety of applications, including but not limited to robotics, medical imaging, and communication systems.
The XCZU5EG-2FBVB900I chip model is equipped with a wide range of features, including a high-speed processing engine, an embedded processor, an image processing engine, and a memory controller. This combination of features allows the chip to be used in a variety of applications, including but not limited to robotics, medical imaging, and communication systems. In addition, the chip is designed to be highly reliable and efficient, making it an ideal choice for applications requiring high performance.
The XCZU5EG-2FBVB900I chip model is also designed to be user-friendly, with a wide range of design tools available to help users create and customize their applications. The chip also supports a variety of programming languages, including HDL, C, and C++, making it easy for users to develop and deploy their applications.
The XCZU5EG-2FBVB900I chip model can be used in the development and popularization of future intelligent robots. The chip is powerful and versatile enough to handle the complex tasks required of robots, such as navigation, obstacle avoidance, and image processing. In addition, the chip is designed to be highly reliable and efficient, making it an ideal choice for robotics applications.
In order to use the XCZU5EG-2FBVB900I chip model effectively, it is important to understand the product description and specific design requirements of the chip model. It is also important to be aware of potential risks and precautions associated with the use of the chip model. Technical talents are needed to effectively use the chip model, such as engineers with knowledge of HDL, C, and C++ programming languages, as well as knowledge of robotics and image processing.
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2,508 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $8,898.2369 | $8,898.2369 |
| 10+ | $8,802.5570 | $88,025.5696 |
| 100+ | $8,324.1571 | $832,415.7129 |
| 1000+ | $7,845.7573 | $3,922,878.6470 |
| 10000+ | $7,175.9975 | $7,175,997.5250 |
| The price is for reference only, please refer to the actual quotation! | ||