AMD Xilinx
XCZU5EG-2FBVB900E
XCZU5EG-2FBVB900E ECAD Model
XCZU5EG-2FBVB900E Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 850 mV | |
| uPs/uCs/Peripheral ICs Type | PROGRAMMABLE SoC | |
| Technology | CMOS | |
| Supply Voltage-Max | 876 mV | |
| Supply Voltage-Min | 825 mV | |
| Temperature Grade | OTHER | |
| JESD-30 Code | R-PBGA-B900 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 900 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA900,30X30,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Seated Height-Max | 2.88 mm | |
| Width | 31 mm | |
| Length | 31 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, BGA900,30X30,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 | |
| Date Of Intro | 2017-02-15 |
XCZU5EG-2FBVB900E Datasheet Download
XCZU5EG-2FBVB900E Overview
The XCZU5EG-2FBVB900E chip model is a powerful and versatile processor designed for high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL (Hardware Description Language) programming language, making it a great choice for engineers and developers looking to create complex and powerful applications.
The chip model is already being used in a variety of industries, such as automotive, medical, and industrial automation. As the demand for intelligent systems continues to grow, the XCZU5EG-2FBVB900E chip model is likely to become even more popular. It is capable of handling complex tasks and can be used in a variety of networked and intelligent scenarios.
As the demand for intelligent systems increases, the XCZU5EG-2FBVB900E chip model is likely to become even more popular. It is capable of handling complex tasks and can be used in a variety of networked and intelligent scenarios. This chip model can be used in the era of fully intelligent systems and can be used in a variety of applications, such as robotics and autonomous vehicles.
The XCZU5EG-2FBVB900E chip model is a powerful and versatile processor that is designed to be used with the HDL language. As the demand for intelligent systems increases, the chip model is likely to become even more popular. With its ability to handle complex tasks, it can be used in a variety of networked and intelligent scenarios. It is also capable of being used in the era of fully intelligent systems, making it a great choice for engineers and developers looking to create powerful and complex applications.
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2,357 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,815.5981 | $1,815.5981 |
| 10+ | $1,796.0755 | $17,960.7552 |
| 100+ | $1,698.4627 | $169,846.2720 |
| 1000+ | $1,600.8499 | $800,424.9600 |
| 10000+ | $1,464.1920 | $1,464,192.0000 |
| The price is for reference only, please refer to the actual quotation! | ||