AMD Xilinx
XCZU5EG-1FBVB900I
XCZU5EG-1FBVB900I ECAD Model
XCZU5EG-1FBVB900I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 850 mV | |
| uPs/uCs/Peripheral ICs Type | PROGRAMMABLE SoC | |
| Technology | CMOS | |
| Supply Voltage-Max | 876 mV | |
| Supply Voltage-Min | 825 mV | |
| Temperature Grade | INDUSTRIAL | |
| JESD-30 Code | R-PBGA-B900 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 900 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA900,30X30,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Seated Height-Max | 2.88 mm | |
| Width | 31 mm | |
| Length | 31 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, BGA900,30X30,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 |
XCZU5EG-1FBVB900I Datasheet Download
XCZU5EG-1FBVB900I Overview
The chip model XCZU5EG-1FBVB900I is a powerful and versatile device that is suitable for a range of applications. It is a high-performance digital signal processing (DSP) chip that is designed to be used in embedded processing, image processing, and other challenging tasks. It is programmed using the HDL (Hardware Description Language) language, which allows for the creation of complex designs that can be upgraded and improved over time.
The XCZU5EG-1FBVB900I is capable of performing a variety of advanced communication tasks, making it an ideal choice for modern networks. It is capable of providing reliable, high-speed data transmission, allowing it to be used in a variety of network applications. Additionally, it is capable of providing intelligent processing, allowing it to be used in intelligent scenarios such as automated security systems and autonomous vehicles.
The XCZU5EG-1FBVB900I is also capable of being used in the era of fully intelligent systems. It is capable of providing the processing power and data transmission speeds necessary for a fully intelligent system to operate. Additionally, its HDL programming language allows for the creation of complex algorithms that can be used to process data in real-time, allowing it to be used in a variety of intelligent scenarios.
The XCZU5EG-1FBVB900I is a powerful and versatile chip that can be used in a variety of applications. Its ability to provide reliable, high-speed data transmission and intelligent processing makes it an ideal choice for modern networks and intelligent scenarios. Additionally, its ability to be programmed with the HDL language allows for the possibility of future upgrades and improvements, making it a great choice for use in the era of fully intelligent systems.
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2,230 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,620.6775 | $1,620.6775 |
| 10+ | $1,603.2509 | $16,032.5088 |
| 100+ | $1,516.1177 | $151,611.7680 |
| 1000+ | $1,428.9845 | $714,492.2400 |
| 10000+ | $1,306.9980 | $1,306,998.0000 |
| The price is for reference only, please refer to the actual quotation! | ||