AMD Xilinx
XCZU5EG-1FBVB900E
XCZU5EG-1FBVB900E ECAD Model
XCZU5EG-1FBVB900E Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 850 mV | |
| uPs/uCs/Peripheral ICs Type | PROGRAMMABLE SoC | |
| Technology | CMOS | |
| Supply Voltage-Max | 876 mV | |
| Supply Voltage-Min | 825 mV | |
| Temperature Grade | OTHER | |
| JESD-30 Code | R-PBGA-B900 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 900 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA900,30X30,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Seated Height-Max | 2.88 mm | |
| Width | 31 mm | |
| Length | 31 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, BGA900,30X30,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 |
XCZU5EG-1FBVB900E Datasheet Download
XCZU5EG-1FBVB900E Overview
The XCZU5EG-1FBVB900E chip model is a versatile and powerful device that is suitable for a variety of applications. It is especially well-suited for high-performance digital signal processing, embedded processing, and image processing. To use the chip model effectively, the user must be familiar with the hardware description language (HDL) and have a basic understanding of the product description and specific design requirements of the XCZU5EG-1FBVB900E.
The XCZU5EG-1FBVB900E is an FPGA device that has been designed to provide a high-performance, low-power solution for a range of applications. It is equipped with a range of features that make it suitable for a variety of tasks. These include a high-performance embedded processor, a high-speed memory interface, and a range of I/O peripherals. The device also has a range of configurable options that allow the user to tailor the device to their specific application.
In terms of application scenarios, the XCZU5EG-1FBVB900E is suitable for a range of applications, including high-performance digital signal processing, embedded processing, image processing, and more. It is also suitable for the development and popularization of future intelligent robots. To use the model effectively, the user must possess the necessary technical skills, such as the ability to design and program HDL-based systems.
In addition, it is important to be aware of the specific design requirements of the XCZU5EG-1FBVB900E. It is important to understand the product description and specific design requirements of the device, as well as the actual case studies and precautions associated with the device. This will ensure that the user is able to use the device effectively and safely.
In conclusion, the XCZU5EG-1FBVB900E is a powerful and versatile device that is suitable for a range of applications. It is especially suitable for high-performance digital signal processing, embedded processing, and image processing. It is also suitable for the development and popularization of future intelligent robots. To use the model effectively, the user must possess the necessary technical skills, such as the ability to design and program HDL-based systems. It is also important to be aware of the product description and specific design requirements of the XCZU5EG-1FBVB900E, as well as the actual case studies and precautions associated with the device.
You May Also Be Interested In
2,501 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,370.5224 | $1,370.5224 |
| 10+ | $1,355.7856 | $13,557.8560 |
| 100+ | $1,282.1016 | $128,210.1600 |
| 1000+ | $1,208.4176 | $604,208.8000 |
| 10000+ | $1,105.2600 | $1,105,260.0000 |
| The price is for reference only, please refer to the actual quotation! | ||