AMD Xilinx
XCZU5CG-2FBVB900E
XCZU5CG-2FBVB900E ECAD Model
XCZU5CG-2FBVB900E Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 850 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Supply Voltage-Max | 876 mV | |
| Supply Voltage-Min | 825 mV | |
| Temperature Grade | OTHER | |
| JESD-30 Code | R-PBGA-B900 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 900 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Seated Height-Max | 2.88 mm | |
| Width | 31 mm | |
| Length | 31 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, BGA900,30X30,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 | |
| Date Of Intro | 2017-02-15 |
XCZU5CG-2FBVB900E Datasheet Download
XCZU5CG-2FBVB900E Overview
The chip model XCZU5CG-2FBVB900E is a high-performance digital signal processing chip that uses HDL language. It is suitable for embedded processing, image processing, and other applications. With its powerful processing capabilities and low power consumption, it has become an indispensable tool for many industries.
The industry trends of the chip model XCZU5CG-2FBVB900E are constantly changing. With the development of new technologies, more and more applications are being developed to take advantage of the chip's capabilities. For example, advanced communication systems can benefit from the chip's high-speed processing capabilities, allowing for faster data transmission and improved communication performance.
The original design intention of the chip model XCZU5CG-2FBVB900E was to provide powerful processing capabilities while consuming minimal power. This makes it ideal for applications that require high-performance processing but need to conserve energy. In the future, the chip can be upgraded to support new technologies, allowing it to be used in more advanced applications.
Overall, the chip model XCZU5CG-2FBVB900E is an ideal choice for those who need powerful processing capabilities while consuming minimal power. With its wide range of applications and the potential for future upgrades, it is sure to remain a popular choice for many industries.
You May Also Be Interested In
1,720 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,655.4521 | $1,655.4521 |
| 10+ | $1,637.6515 | $16,376.5152 |
| 100+ | $1,548.6487 | $154,864.8720 |
| 1000+ | $1,459.6459 | $729,822.9600 |
| 10000+ | $1,335.0420 | $1,335,042.0000 |
| The price is for reference only, please refer to the actual quotation! | ||