AMD Xilinx
XCZU5CG-1FBVB900I
XCZU5CG-1FBVB900I ECAD Model
XCZU5CG-1FBVB900I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 850 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Supply Voltage-Max | 876 mV | |
| Supply Voltage-Min | 825 mV | |
| Temperature Grade | INDUSTRIAL | |
| JESD-30 Code | R-PBGA-B900 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 900 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, BGA900,30X30,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 |
XCZU5CG-1FBVB900I Datasheet Download
XCZU5CG-1FBVB900I Overview
The XCZU5CG-1FBVB900I chip model is a powerful and versatile technology that is suitable for a wide range of applications. It is primarily used in high-performance digital signal processing, embedded processing, and image processing. To use this chip model, a user must be proficient in the HDL language.
The potential applications of the XCZU5CG-1FBVB900I chip model in the future are vast. It can be used in intelligent networks and systems, enabling the development of sophisticated and efficient systems. It can also be used to create intelligent robots and machines, which could be used in a variety of ways in the future.
To use the XCZU5CG-1FBVB900I chip model effectively, it is important to have the right technical skills. This includes a deep understanding of the HDL language, as well as knowledge of digital signal processing, embedded processing, and image processing. It is also important to have an understanding of the potential applications of the chip model and the ways in which it can be used to create intelligent systems.
In conclusion, the XCZU5CG-1FBVB900I chip model is a powerful and versatile technology that can be used in a variety of ways. It is suitable for high-performance digital signal processing, embedded processing, and image processing. It is also suitable for intelligent networks and systems, and can be used to create intelligent robots and machines. To use this chip model effectively, it is important to have the right technical skills and knowledge.
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1,038 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,477.9188 | $1,477.9188 |
| 10+ | $1,462.0272 | $14,620.2720 |
| 100+ | $1,382.5692 | $138,256.9200 |
| 1000+ | $1,303.1112 | $651,555.6000 |
| 10000+ | $1,191.8700 | $1,191,870.0000 |
| The price is for reference only, please refer to the actual quotation! | ||