XCZU4EV-L1FBVB900I
XCZU4EV-L1FBVB900I
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

AMD Xilinx

XCZU4EV-L1FBVB900I


XCZU4EV-L1FBVB900I
F20-XCZU4EV-L1FBVB900I
Active
CMOS, BGA, BGA900,30X30,40
BGA, BGA900,30X30,40

XCZU4EV-L1FBVB900I ECAD Model


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XCZU4EV-L1FBVB900I Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 720 mV
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Additional Feature ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
Supply Voltage-Max 742 mV
Supply Voltage-Min 698 mV
Temperature Grade INDUSTRIAL
JESD-30 Code R-PBGA-B900
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 900
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description BGA, BGA900,30X30,40
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01

XCZU4EV-L1FBVB900I Datasheet Download


XCZU4EV-L1FBVB900I Overview



The Xilinx XCZU4EV-L1FBVB900I chip model is a powerful solution for those seeking a powerful, efficient and cost-effective microcontroller. It is a high-performance, low-cost, low-power, and low-endurance chip model that is designed to meet the needs of industrial, embedded, and communication applications.


The XCZU4EV-L1FBVB900I chip model is designed with a range of features to ensure it meets the needs of its users. It has a wide range of peripherals and interfaces, including a USB controller, I2C, SPI, UART, and GPIOs. It also has an ARM Cortex-A53 processor, a high-performance memory controller, and a high-speed network interface. This combination of features makes it well-suited for a variety of applications.


The XCZU4EV-L1FBVB900I chip model is designed with the latest technology and is capable of meeting the requirements of the most demanding applications. It has the capability to support advanced communication systems, and its memory controller can be used to support high-speed data transfer. It also has a powerful ARM Cortex-A53 processor and a high-speed network interface.


The XCZU4EV-L1FBVB900I chip model has a number of advantages over other chip models. It is designed with a wide range of peripherals and interfaces, making it suitable for a variety of applications. It also has a high-performance memory controller and a powerful ARM Cortex-A53 processor. It is also cost-effective, making it an attractive option for those looking for a powerful and efficient microcontroller.


In terms of future demand, the XCZU4EV-L1FBVB900I chip model is expected to be in high demand in the coming years. It is a powerful, efficient and cost-effective solution for those seeking a reliable and robust microcontroller for a variety of applications. Its wide range of peripherals and interfaces, coupled with its powerful ARM Cortex-A53 processor and high-speed network interface, make it a great choice for those looking for a reliable and powerful microcontroller.


In terms of the original design intention of the XCZU4EV-L1FBVB900I chip model, it was designed with the intention of providing a powerful, efficient and cost-effective solution for those seeking a reliable and robust microcontroller. It was designed to meet the needs of industrial, embedded, and communication applications and to provide a high-performance memory controller and a powerful ARM Cortex-A53 processor.


In terms of future upgrades, the XCZU4EV-L1FBVB900I chip model is designed with the intention of making it easy to upgrade and add new features. It has the capability to support advanced communication systems and its memory controller can be used to support high-speed data transfer. It also has a powerful ARM Cortex-A53 processor and a high-speed network interface.


In terms of product description and specific design requirements, the XCZU4EV-L1FBVB900I chip model is designed with a range of features to ensure it meets the needs of its users. It has a wide range of peripherals and interfaces, including a USB controller, I2C, SPI, UART, and GPIOs. It also has an ARM Cortex-A53 processor, a high-performance memory controller, and a high-speed network interface.


In terms of actual case studies and precautions, the XCZU4EV-L1FBVB900I chip model has been successfully used in a variety of applications. It has been used in industrial, embedded, and communication applications and has been found to be reliable and robust. It is important to note, however, that the chip model should only be used in applications where it is suitable and should not be used in applications where it is not suitable. In addition, it is important to ensure that the chip model is properly configured and that the correct peripherals and interfaces are used.



5,815 In Stock


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Unit Price: $6,976.1319
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Pricing (USD)

QTY Unit Price Ext Price
1+ $6,487.8027 $6,487.8027
10+ $6,418.0413 $64,180.4135
100+ $6,069.2348 $606,923.4753
1000+ $5,720.4282 $2,860,214.0790
10000+ $5,232.0989 $5,232,098.9250
The price is for reference only, please refer to the actual quotation!

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