XCZU4EV-3FBVB900E
XCZU4EV-3FBVB900E
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rohs

AMD Xilinx

XCZU4EV-3FBVB900E


XCZU4EV-3FBVB900E
F20-XCZU4EV-3FBVB900E
Active
CMOS, BGA, BGA900,30X30,40
BGA, BGA900,30X30,40

XCZU4EV-3FBVB900E ECAD Model


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XCZU4EV-3FBVB900E Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 900 mV
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Supply Voltage-Max 927 mV
Supply Voltage-Min 873 mV
Temperature Grade OTHER
JESD-30 Code R-PBGA-B900
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 900
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description BGA, BGA900,30X30,40
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01

XCZU4EV-3FBVB900E Datasheet Download


XCZU4EV-3FBVB900E Overview



The chip model XCZU4EV-3FBVB900E is a powerful tool in the world of technology. It is a programmable logic device (PLD) with a dual-core ARM Cortex-A53 processor and a Mali-400 MP2 GPU. This chip model is designed to provide a high-performance, low-power solution for a variety of applications, such as network systems, intelligent systems, and robotics.


The XCZU4EV-3FBVB900E chip model is an ideal choice for network systems. It is designed to provide high-speed, low-latency communication and networking capabilities. It supports both wired and wireless communication protocols, such as Ethernet, Wi-Fi, Bluetooth, and Zigbee. It also supports a range of intelligent scenarios, such as machine learning, natural language processing, and computer vision. Additionally, it is designed to be used in the era of fully intelligent systems, with its support for a variety of intelligent platforms, such as the TensorFlow, Google Cloud Platform, and Amazon Web Services.


The product description and specific design requirements of the chip model XCZU4EV-3FBVB900E are based on the specific needs of the user. It is designed to provide a wide range of features, such as high-speed data transfer, low-power consumption, and support for a variety of communication protocols. It also supports a range of development tools, such as the Xilinx Vivado Design Suite and the Xilinx SDK. Additionally, the chip model has a wide range of case studies which can be used as reference points for users when designing their own applications.


The XCZU4EV-3FBVB900E chip model is also suitable for use in the development and popularization of future intelligent robots. It is designed to provide a high-performance, low-power solution for robotics applications, such as autonomous navigation, object recognition, and motion control. It is also designed to support a range of development tools, such as the Robot Operating System (ROS) and the Robot Control Language (RCL). To use the chip model effectively, it is important to have a strong background in computer engineering, robotics, and artificial intelligence.


In conclusion, the XCZU4EV-3FBVB900E chip model is a powerful tool for a variety of applications, such as network systems, intelligent systems, and robotics. It is designed to provide a high-performance, low-power solution for a variety of applications, and it is suitable for use in the development and popularization of future intelligent robots. To use the chip model effectively, it is important to have a strong background in computer engineering, robotics, and artificial intelligence.



4,353 In Stock


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Unit Price: $1,983.744
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $1,844.8819 $1,844.8819
10+ $1,825.0445 $18,250.4448
100+ $1,725.8573 $172,585.7280
1000+ $1,626.6701 $813,335.0400
10000+ $1,487.8080 $1,487,808.0000
The price is for reference only, please refer to the actual quotation!

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