
AMD Xilinx
XCZU4EV-3FBVB900E
XCZU4EV-3FBVB900E ECAD Model
XCZU4EV-3FBVB900E Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Surface Mount | YES | |
Supply Voltage-Nom | 900 mV | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
Technology | CMOS | |
Supply Voltage-Max | 927 mV | |
Supply Voltage-Min | 873 mV | |
Temperature Grade | OTHER | |
JESD-30 Code | R-PBGA-B900 | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 100 °C | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 900 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Position | BOTTOM | |
Ihs Manufacturer | XILINX INC | |
Package Description | BGA, BGA900,30X30,40 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A002.A.4 | |
HTS Code | 8542.39.00.01 |
XCZU4EV-3FBVB900E Datasheet Download
XCZU4EV-3FBVB900E Overview
The chip model XCZU4EV-3FBVB900E is a powerful tool in the world of technology. It is a programmable logic device (PLD) with a dual-core ARM Cortex-A53 processor and a Mali-400 MP2 GPU. This chip model is designed to provide a high-performance, low-power solution for a variety of applications, such as network systems, intelligent systems, and robotics.
The XCZU4EV-3FBVB900E chip model is an ideal choice for network systems. It is designed to provide high-speed, low-latency communication and networking capabilities. It supports both wired and wireless communication protocols, such as Ethernet, Wi-Fi, Bluetooth, and Zigbee. It also supports a range of intelligent scenarios, such as machine learning, natural language processing, and computer vision. Additionally, it is designed to be used in the era of fully intelligent systems, with its support for a variety of intelligent platforms, such as the TensorFlow, Google Cloud Platform, and Amazon Web Services.
The product description and specific design requirements of the chip model XCZU4EV-3FBVB900E are based on the specific needs of the user. It is designed to provide a wide range of features, such as high-speed data transfer, low-power consumption, and support for a variety of communication protocols. It also supports a range of development tools, such as the Xilinx Vivado Design Suite and the Xilinx SDK. Additionally, the chip model has a wide range of case studies which can be used as reference points for users when designing their own applications.
The XCZU4EV-3FBVB900E chip model is also suitable for use in the development and popularization of future intelligent robots. It is designed to provide a high-performance, low-power solution for robotics applications, such as autonomous navigation, object recognition, and motion control. It is also designed to support a range of development tools, such as the Robot Operating System (ROS) and the Robot Control Language (RCL). To use the chip model effectively, it is important to have a strong background in computer engineering, robotics, and artificial intelligence.
In conclusion, the XCZU4EV-3FBVB900E chip model is a powerful tool for a variety of applications, such as network systems, intelligent systems, and robotics. It is designed to provide a high-performance, low-power solution for a variety of applications, and it is suitable for use in the development and popularization of future intelligent robots. To use the chip model effectively, it is important to have a strong background in computer engineering, robotics, and artificial intelligence.
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4,353 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $1,844.8819 | $1,844.8819 |
10+ | $1,825.0445 | $18,250.4448 |
100+ | $1,725.8573 | $172,585.7280 |
1000+ | $1,626.6701 | $813,335.0400 |
10000+ | $1,487.8080 | $1,487,808.0000 |
The price is for reference only, please refer to the actual quotation! |