AMD Xilinx
XCZU4EV-2FBVB900E
XCZU4EV-2FBVB900E ECAD Model
XCZU4EV-2FBVB900E Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 850 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Supply Voltage-Max | 876 mV | |
| Supply Voltage-Min | 825 mV | |
| Temperature Grade | OTHER | |
| JESD-30 Code | R-PBGA-B900 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 900 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Seated Height-Max | 2.88 mm | |
| Width | 31 mm | |
| Length | 31 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, BGA900,30X30,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 | |
| Date Of Intro | 2017-02-15 |
XCZU4EV-2FBVB900E Datasheet Download
XCZU4EV-2FBVB900E Overview
The XCZU4EV-2FBVB900E chip model is a powerful and versatile model that can be used for a wide range of applications, including high-performance digital signal processing, embedded processing, and image processing. It is designed to be easily programmable using the HDL language, making it an ideal choice for those looking for a powerful and flexible chip model.
The original design intention of the XCZU4EV-2FBVB900E chip model was to provide users with a powerful and versatile solution that can be used for a wide range of applications. It is designed to be easily upgradable, allowing users to make changes to the chip model as needed. This makes it an ideal choice for those looking for a powerful and flexible chip model. Additionally, the XCZU4EV-2FBVB900E chip model can be used for advanced communication systems, making it a great choice for those looking for a powerful and versatile chip model.
The XCZU4EV-2FBVB900E chip model can also be used for the development and popularization of future intelligent robots. The chip model is designed to be easily programmable using the HDL language, making it an ideal choice for those looking to create powerful and flexible robots. Additionally, the chip model is designed to be easily upgradable, allowing users to make changes to the chip model as needed. This makes it an ideal choice for those looking to create powerful and flexible robots.
In order to use the XCZU4EV-2FBVB900E chip model effectively, it is important to have a good understanding of the HDL language. Additionally, it is important to have a good understanding of the chip model and its capabilities, as well as the ability to effectively program the chip model. Additionally, it is important to have a good understanding of the capabilities of the chip model, as well as the ability to effectively program the chip model. Those looking to use the XCZU4EV-2FBVB900E chip model effectively should have a good understanding of the HDL language, as well as the chip model and its capabilities.
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2,088 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $5,676.8270 | $5,676.8270 |
| 10+ | $5,615.7859 | $56,157.8589 |
| 100+ | $5,310.5801 | $531,058.0137 |
| 1000+ | $5,005.3744 | $2,502,687.1910 |
| 10000+ | $4,578.0863 | $4,578,086.3250 |
| The price is for reference only, please refer to the actual quotation! | ||