
AMD Xilinx
XCZU4EV-1FBVB900I
XCZU4EV-1FBVB900I ECAD Model
XCZU4EV-1FBVB900I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Surface Mount | YES | |
Supply Voltage-Nom | 850 mV | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
Technology | CMOS | |
Supply Voltage-Max | 876 mV | |
Supply Voltage-Min | 825 mV | |
Temperature Grade | INDUSTRIAL | |
JESD-30 Code | R-PBGA-B900 | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 900 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Position | BOTTOM | |
Ihs Manufacturer | XILINX INC | |
Package Description | BGA, BGA900,30X30,40 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A002.A.4 | |
HTS Code | 8542.39.00.01 |
XCZU4EV-1FBVB900I Datasheet Download
XCZU4EV-1FBVB900I Overview
The chip model XCZU4EV-1FBVB900I is a powerful, high-performance chip designed for a wide range of applications. It is a multi-core, multi-threaded processor with a high-speed, low-power architecture that is optimized for a variety of applications. It is one of the most advanced chips available on the market today, offering an impressive range of features and capabilities.
The XCZU4EV-1FBVB900I is a versatile chip that can be used in a wide range of applications, including networking, artificial intelligence (AI), machine learning, and other applications. It is capable of processing data quickly and efficiently, making it an ideal choice for many applications. In addition, it is capable of supporting a variety of operating systems, including Linux, Windows, and macOS.
The XCZU4EV-1FBVB900I is expected to be in high demand in the future, as more and more applications require the support of the chip's advanced capabilities. In the era of fully intelligent systems, the chip is expected to be used in a variety of intelligent scenarios, such as autonomous vehicles, robotics, and other applications. It is also expected to be used in networks, as it is capable of providing high-speed, low-power processing.
The XCZU4EV-1FBVB900I is a powerful and versatile chip, and its future applications are expected to be wide-reaching. As it is capable of supporting a variety of operating systems and intelligent scenarios, it is expected to be in high demand in the future. As such, it is important to consider the industry trends of the chip model XCZU4EV-1FBVB900I and the future development of related industries, as well as what specific technologies may be needed in order to make use of the chip's capabilities.
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2,722 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $789.7093 | $789.7093 |
10+ | $781.2178 | $7,812.1782 |
100+ | $738.7603 | $73,876.0326 |
1000+ | $696.3028 | $348,151.4180 |
10000+ | $636.8624 | $636,862.3500 |
The price is for reference only, please refer to the actual quotation! |