XCZU4EV-1FBVB900I
XCZU4EV-1FBVB900I
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rohs

AMD Xilinx

XCZU4EV-1FBVB900I


XCZU4EV-1FBVB900I
F20-XCZU4EV-1FBVB900I
Active
CMOS, BGA, BGA900,30X30,40
BGA, BGA900,30X30,40

XCZU4EV-1FBVB900I ECAD Model


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XCZU4EV-1FBVB900I Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 850 mV
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Supply Voltage-Max 876 mV
Supply Voltage-Min 825 mV
Temperature Grade INDUSTRIAL
JESD-30 Code R-PBGA-B900
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 900
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description BGA, BGA900,30X30,40
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01

XCZU4EV-1FBVB900I Datasheet Download


XCZU4EV-1FBVB900I Overview



The chip model XCZU4EV-1FBVB900I is a powerful, high-performance chip designed for a wide range of applications. It is a multi-core, multi-threaded processor with a high-speed, low-power architecture that is optimized for a variety of applications. It is one of the most advanced chips available on the market today, offering an impressive range of features and capabilities.


The XCZU4EV-1FBVB900I is a versatile chip that can be used in a wide range of applications, including networking, artificial intelligence (AI), machine learning, and other applications. It is capable of processing data quickly and efficiently, making it an ideal choice for many applications. In addition, it is capable of supporting a variety of operating systems, including Linux, Windows, and macOS.


The XCZU4EV-1FBVB900I is expected to be in high demand in the future, as more and more applications require the support of the chip's advanced capabilities. In the era of fully intelligent systems, the chip is expected to be used in a variety of intelligent scenarios, such as autonomous vehicles, robotics, and other applications. It is also expected to be used in networks, as it is capable of providing high-speed, low-power processing.


The XCZU4EV-1FBVB900I is a powerful and versatile chip, and its future applications are expected to be wide-reaching. As it is capable of supporting a variety of operating systems and intelligent scenarios, it is expected to be in high demand in the future. As such, it is important to consider the industry trends of the chip model XCZU4EV-1FBVB900I and the future development of related industries, as well as what specific technologies may be needed in order to make use of the chip's capabilities.



2,722 In Stock


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Unit Price: $849.1498
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $789.7093 $789.7093
10+ $781.2178 $7,812.1782
100+ $738.7603 $73,876.0326
1000+ $696.3028 $348,151.4180
10000+ $636.8624 $636,862.3500
The price is for reference only, please refer to the actual quotation!

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