AMD Xilinx
XCZU4EV-1FBVB900E
XCZU4EV-1FBVB900E ECAD Model
XCZU4EV-1FBVB900E Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 850 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Supply Voltage-Max | 876 mV | |
| Supply Voltage-Min | 825 mV | |
| Temperature Grade | OTHER | |
| JESD-30 Code | R-PBGA-B900 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 900 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, BGA900,30X30,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 |
XCZU4EV-1FBVB900E Datasheet Download
XCZU4EV-1FBVB900E Overview
The chip model XCZU4EV-1FBVB900E is a state-of-the-art chip model that has been developed to meet the needs of the ever-evolving industry trends and technologies. This chip model is capable of handling the most advanced technologies and providing powerful support for the latest applications. It is an ideal choice for the development of future intelligent systems.
This chip model is designed to support the latest technologies, such as 5G networks, artificial intelligence, and machine learning. It can be used to develop and deploy advanced applications in these areas, such as intelligent robots, autonomous vehicles, and smart home systems. It is also capable of providing support for the development of next-generation networks and high-performance computing systems.
The chip model XCZU4EV-1FBVB900E has been designed to be used in the most advanced applications and scenarios. For example, it can be used in the development of fully intelligent systems, such as those used in the Internet of Things (IoT). It can also be used to develop and deploy advanced applications in the areas of robotics, autonomous vehicles, and smart home systems.
In order to effectively use the chip model XCZU4EV-1FBVB900E, it is necessary to have a good understanding of the underlying technologies and their applications. Technical knowledge in the areas of computer engineering, electronics, and software engineering is essential for the effective use of this chip model. Furthermore, knowledge in the areas of artificial intelligence, machine learning, and network engineering is also necessary to effectively use this chip model.
In conclusion, the chip model XCZU4EV-1FBVB900E is a powerful and reliable chip model that is capable of providing support for the development and deployment of advanced applications in the areas of networks, artificial intelligence, and machine learning. It is an ideal choice for the development of future intelligent systems and can be used to develop and deploy advanced applications in the areas of robotics, autonomous vehicles, and smart home systems. In order to use this chip model effectively, it is necessary to have a good understanding of the underlying technologies and their applications.
You May Also Be Interested In
3,608 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,010.2227 | $1,010.2227 |
| 10+ | $999.3601 | $9,993.6012 |
| 100+ | $945.0471 | $94,504.7070 |
| 1000+ | $890.7340 | $445,367.0100 |
| 10000+ | $814.6958 | $814,695.7500 |
| The price is for reference only, please refer to the actual quotation! | ||