
AMD Xilinx
XCZU4EG-3FBVB900E
XCZU4EG-3FBVB900E ECAD Model
XCZU4EG-3FBVB900E Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Surface Mount | YES | |
Supply Voltage-Nom | 900 mV | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
Technology | CMOS | |
Supply Voltage-Max | 927 mV | |
Supply Voltage-Min | 873 mV | |
Temperature Grade | OTHER | |
JESD-30 Code | R-PBGA-B900 | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 100 °C | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 900 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Position | BOTTOM | |
Ihs Manufacturer | XILINX INC | |
Package Description | BGA, BGA900,30X30,40 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A002.A.4 | |
HTS Code | 8542.39.00.01 |
XCZU4EG-3FBVB900E Datasheet Download
XCZU4EG-3FBVB900E Overview
The chip model XCZU4EG-3FBVB900E has been making waves in the technology industry due to its advanced features and capabilities. Developed by Xilinx, this device is a high-performance, low-power, and cost-effective FPGA solution that is designed to meet the demands of today’s data-centric applications.
This chip model is designed to provide a wide range of features, including a high-speed transceiver, a high-performance memory interface, and a high-performance clock management unit. It also supports a wide range of I/O standards, including PCIe, SATA, USB, and Ethernet. This makes it an ideal solution for applications that require high-speed data transfer, such as machine learning, artificial intelligence, and autonomous driving.
The XCZU4EG-3FBVB900E has several advantages over other FPGA solutions. It is a cost-effective solution that provides high performance and low power consumption. It also offers a wide range of features and I/O standards, making it a versatile solution for a variety of applications. Additionally, the chip model is designed to be easy to use and program, allowing developers to quickly create applications and solutions.
The demand for the XCZU4EG-3FBVB900E is expected to grow in the future as more applications are developed that require its advanced features and capabilities. In addition, the chip model is well-suited for applications such as machine learning, artificial intelligence, and autonomous driving, which are expected to become more prevalent in the future.
The product description of the XCZU4EG-3FBVB900E includes a variety of features and capabilities that make it a desirable solution. It is designed to meet the demands of today’s data-centric applications and offers a wide range of features and I/O standards. The chip model also has a high-speed transceiver, a high-performance memory interface, and a high-performance clock management unit.
When designing applications with the XCZU4EG-3FBVB900E, there are several things to keep in mind. First, the chip model is designed to be easy to use and program, but it is important to ensure that the application is optimized for the chip model’s features and capabilities. Additionally, it is important to ensure that the application is designed to take advantage of the chip model’s high-speed transceiver, memory interface, and clock management unit.
To further illustrate the capabilities of the XCZU4EG-3FBVB900E, several case studies have been conducted. One such case study involved the development of an autonomous driving system that used the chip model’s features and capabilities. The system was able to successfully detect objects in its environment and respond accordingly. This case study demonstrated the chip model’s ability to handle the demands of autonomous driving applications.
In conclusion, the chip model XCZU4EG-3FBVB900E is a high-performance, low-power, and cost-effective FPGA solution that is designed to meet the demands of today’s data-centric applications. It offers a wide range of features and I/O standards, making it a versatile solution for a variety of applications. Additionally, the chip model is designed to be easy to use and program, allowing developers to quickly create applications and solutions. The demand for the XCZU4EG-3FBVB900E is expected to grow in the future as more applications are developed that require its advanced features and capabilities.
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5,102 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $1,649.9614 | $1,649.9614 |
10+ | $1,632.2198 | $16,322.1984 |
100+ | $1,543.5122 | $154,351.2240 |
1000+ | $1,454.8046 | $727,402.3200 |
10000+ | $1,330.6140 | $1,330,614.0000 |
The price is for reference only, please refer to the actual quotation! |