XCZU4EG-3FBVB900E
XCZU4EG-3FBVB900E
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

AMD Xilinx

XCZU4EG-3FBVB900E


XCZU4EG-3FBVB900E
F20-XCZU4EG-3FBVB900E
Active
CMOS, BGA, BGA900,30X30,40
BGA, BGA900,30X30,40

XCZU4EG-3FBVB900E ECAD Model


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XCZU4EG-3FBVB900E Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 900 mV
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Supply Voltage-Max 927 mV
Supply Voltage-Min 873 mV
Temperature Grade OTHER
JESD-30 Code R-PBGA-B900
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 900
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description BGA, BGA900,30X30,40
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01

XCZU4EG-3FBVB900E Datasheet Download


XCZU4EG-3FBVB900E Overview



The chip model XCZU4EG-3FBVB900E has been making waves in the technology industry due to its advanced features and capabilities. Developed by Xilinx, this device is a high-performance, low-power, and cost-effective FPGA solution that is designed to meet the demands of today’s data-centric applications.


This chip model is designed to provide a wide range of features, including a high-speed transceiver, a high-performance memory interface, and a high-performance clock management unit. It also supports a wide range of I/O standards, including PCIe, SATA, USB, and Ethernet. This makes it an ideal solution for applications that require high-speed data transfer, such as machine learning, artificial intelligence, and autonomous driving.


The XCZU4EG-3FBVB900E has several advantages over other FPGA solutions. It is a cost-effective solution that provides high performance and low power consumption. It also offers a wide range of features and I/O standards, making it a versatile solution for a variety of applications. Additionally, the chip model is designed to be easy to use and program, allowing developers to quickly create applications and solutions.


The demand for the XCZU4EG-3FBVB900E is expected to grow in the future as more applications are developed that require its advanced features and capabilities. In addition, the chip model is well-suited for applications such as machine learning, artificial intelligence, and autonomous driving, which are expected to become more prevalent in the future.


The product description of the XCZU4EG-3FBVB900E includes a variety of features and capabilities that make it a desirable solution. It is designed to meet the demands of today’s data-centric applications and offers a wide range of features and I/O standards. The chip model also has a high-speed transceiver, a high-performance memory interface, and a high-performance clock management unit.


When designing applications with the XCZU4EG-3FBVB900E, there are several things to keep in mind. First, the chip model is designed to be easy to use and program, but it is important to ensure that the application is optimized for the chip model’s features and capabilities. Additionally, it is important to ensure that the application is designed to take advantage of the chip model’s high-speed transceiver, memory interface, and clock management unit.


To further illustrate the capabilities of the XCZU4EG-3FBVB900E, several case studies have been conducted. One such case study involved the development of an autonomous driving system that used the chip model’s features and capabilities. The system was able to successfully detect objects in its environment and respond accordingly. This case study demonstrated the chip model’s ability to handle the demands of autonomous driving applications.


In conclusion, the chip model XCZU4EG-3FBVB900E is a high-performance, low-power, and cost-effective FPGA solution that is designed to meet the demands of today’s data-centric applications. It offers a wide range of features and I/O standards, making it a versatile solution for a variety of applications. Additionally, the chip model is designed to be easy to use and program, allowing developers to quickly create applications and solutions. The demand for the XCZU4EG-3FBVB900E is expected to grow in the future as more applications are developed that require its advanced features and capabilities.



5,102 In Stock


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Unit Price: $1,774.152
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $1,649.9614 $1,649.9614
10+ $1,632.2198 $16,322.1984
100+ $1,543.5122 $154,351.2240
1000+ $1,454.8046 $727,402.3200
10000+ $1,330.6140 $1,330,614.0000
The price is for reference only, please refer to the actual quotation!

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