XCZU4EG-2FBVB900I
XCZU4EG-2FBVB900I
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

AMD Xilinx

XCZU4EG-2FBVB900I


XCZU4EG-2FBVB900I
F20-XCZU4EG-2FBVB900I
Active
CMOS, BGA, BGA900,30X30,40
BGA, BGA900,30X30,40

XCZU4EG-2FBVB900I ECAD Model


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XCZU4EG-2FBVB900I Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 850 mV
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Supply Voltage-Max 876 mV
Supply Voltage-Min 825 mV
Temperature Grade INDUSTRIAL
JESD-30 Code R-PBGA-B900
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 900
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description BGA, BGA900,30X30,40
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01

XCZU4EG-2FBVB900I Datasheet Download


XCZU4EG-2FBVB900I Overview



The Xilinx Zynq UltraScale+ MPSoC XCZU4EG-2FBVB900I is a powerful and versatile chip model that is capable of meeting the needs of a wide range of applications. It is a high-performance, low-power, multi-core processor with a wide range of features, including dual-core ARM Cortex-A53 processors and a Mali-400 MP2 GPU. It also includes a variety of peripherals, such as a Gigabit Ethernet port, a USB 3.0 port, and a dual-channel DDR4 memory controller.


The Xilinx Zynq UltraScale+ MPSoC XCZU4EG-2FBVB900I is designed to be used in a variety of applications, including embedded systems, industrial automation, automotive systems, and medical devices. It is also suitable for applications that require high-performance computing, such as video analytics and machine learning. The chip model is highly customizable and can be used in a wide range of applications.


The Xilinx Zynq UltraScale+ MPSoC XCZU4EG-2FBVB900I supports a wide range of technologies, including the latest 5G and Wi-Fi 6 standards. It also supports a wide range of communication protocols, such as Ethernet, USB, and CAN. It also supports a variety of operating systems, including Linux, Android, Windows, and RTOS. The chip model is also capable of supporting a wide range of development tools, such as Xilinx Vivado and Petalinux.


In terms of industry trends, the Xilinx Zynq UltraScale+ MPSoC XCZU4EG-2FBVB900I is capable of meeting the needs of a wide range of applications, from consumer electronics to industrial automation. It is also capable of supporting new technologies, such as 5G and Wi-Fi 6, as well as a wide range of communication protocols. Furthermore, the chip model is designed to be highly customizable, allowing developers to tailor the chip model to their specific application requirements.


The Xilinx Zynq UltraScale+ MPSoC XCZU4EG-2FBVB900I also has the potential to be upgraded in the future, allowing developers to take advantage of new technologies and features as they become available. In addition, the chip model is designed to be highly reliable, with features such as ECC memory and secure boot.


When considering the Xilinx Zynq UltraScale+ MPSoC XCZU4EG-2FBVB900I for a specific application, it is important to consider the specific design requirements of the application. For example, the chip model may require additional peripherals, such as a CAN bus controller or a PCIe controller, in order to meet the application's requirements. It is also important to consider the environment in which the chip model will be used and the potential risks associated with the application.


In conclusion, the Xilinx Zynq UltraScale+ MPSoC XCZU4EG-2FBVB900I is a powerful and versatile chip model that is capable of meeting the needs of a wide range of applications. It is designed to be highly customizable and can be used in a variety of applications, including embedded systems, industrial automation, automotive systems, and medical devices. It is also capable of supporting a wide range of technologies and communication protocols, as well as a variety of development tools. Furthermore, it is designed to be upgradeable in the future and is highly reliable. When considering the chip model for a specific application, it is important to consider the specific design requirements of the application and the potential risks associated with the application.



5,355 In Stock


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Unit Price: $6,244.5335
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $5,807.4162 $5,807.4162
10+ $5,744.9708 $57,449.7082
100+ $5,432.7441 $543,274.4145
1000+ $5,120.5175 $2,560,258.7350
10000+ $4,683.4001 $4,683,400.1250
The price is for reference only, please refer to the actual quotation!

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