
AMD Xilinx
XCZU4EG-2FBVB900I
XCZU4EG-2FBVB900I ECAD Model
XCZU4EG-2FBVB900I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Surface Mount | YES | |
Supply Voltage-Nom | 850 mV | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
Technology | CMOS | |
Supply Voltage-Max | 876 mV | |
Supply Voltage-Min | 825 mV | |
Temperature Grade | INDUSTRIAL | |
JESD-30 Code | R-PBGA-B900 | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 900 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Position | BOTTOM | |
Ihs Manufacturer | XILINX INC | |
Package Description | BGA, BGA900,30X30,40 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A002.A.4 | |
HTS Code | 8542.39.00.01 |
XCZU4EG-2FBVB900I Datasheet Download
XCZU4EG-2FBVB900I Overview
The Xilinx Zynq UltraScale+ MPSoC XCZU4EG-2FBVB900I is a powerful and versatile chip model that is capable of meeting the needs of a wide range of applications. It is a high-performance, low-power, multi-core processor with a wide range of features, including dual-core ARM Cortex-A53 processors and a Mali-400 MP2 GPU. It also includes a variety of peripherals, such as a Gigabit Ethernet port, a USB 3.0 port, and a dual-channel DDR4 memory controller.
The Xilinx Zynq UltraScale+ MPSoC XCZU4EG-2FBVB900I is designed to be used in a variety of applications, including embedded systems, industrial automation, automotive systems, and medical devices. It is also suitable for applications that require high-performance computing, such as video analytics and machine learning. The chip model is highly customizable and can be used in a wide range of applications.
The Xilinx Zynq UltraScale+ MPSoC XCZU4EG-2FBVB900I supports a wide range of technologies, including the latest 5G and Wi-Fi 6 standards. It also supports a wide range of communication protocols, such as Ethernet, USB, and CAN. It also supports a variety of operating systems, including Linux, Android, Windows, and RTOS. The chip model is also capable of supporting a wide range of development tools, such as Xilinx Vivado and Petalinux.
In terms of industry trends, the Xilinx Zynq UltraScale+ MPSoC XCZU4EG-2FBVB900I is capable of meeting the needs of a wide range of applications, from consumer electronics to industrial automation. It is also capable of supporting new technologies, such as 5G and Wi-Fi 6, as well as a wide range of communication protocols. Furthermore, the chip model is designed to be highly customizable, allowing developers to tailor the chip model to their specific application requirements.
The Xilinx Zynq UltraScale+ MPSoC XCZU4EG-2FBVB900I also has the potential to be upgraded in the future, allowing developers to take advantage of new technologies and features as they become available. In addition, the chip model is designed to be highly reliable, with features such as ECC memory and secure boot.
When considering the Xilinx Zynq UltraScale+ MPSoC XCZU4EG-2FBVB900I for a specific application, it is important to consider the specific design requirements of the application. For example, the chip model may require additional peripherals, such as a CAN bus controller or a PCIe controller, in order to meet the application's requirements. It is also important to consider the environment in which the chip model will be used and the potential risks associated with the application.
In conclusion, the Xilinx Zynq UltraScale+ MPSoC XCZU4EG-2FBVB900I is a powerful and versatile chip model that is capable of meeting the needs of a wide range of applications. It is designed to be highly customizable and can be used in a variety of applications, including embedded systems, industrial automation, automotive systems, and medical devices. It is also capable of supporting a wide range of technologies and communication protocols, as well as a variety of development tools. Furthermore, it is designed to be upgradeable in the future and is highly reliable. When considering the chip model for a specific application, it is important to consider the specific design requirements of the application and the potential risks associated with the application.
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5,355 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $5,807.4162 | $5,807.4162 |
10+ | $5,744.9708 | $57,449.7082 |
100+ | $5,432.7441 | $543,274.4145 |
1000+ | $5,120.5175 | $2,560,258.7350 |
10000+ | $4,683.4001 | $4,683,400.1250 |
The price is for reference only, please refer to the actual quotation! |