AMD Xilinx
XCZU4CG-L2FBVB900E
XCZU4CG-L2FBVB900E ECAD Model
XCZU4CG-L2FBVB900E Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 720 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Additional Feature | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | |
| Supply Voltage-Max | 742 mV | |
| Supply Voltage-Min | 698 mV | |
| Temperature Grade | OTHER | |
| JESD-30 Code | R-PBGA-B900 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 110 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 900 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, BGA900,30X30,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 |
XCZU4CG-L2FBVB900E Datasheet Download
XCZU4CG-L2FBVB900E Overview
The XCZU4CG-L2FBVB900E chip model is a powerful and versatile device that is ideal for a range of applications, including high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language, allowing for flexibility and ease of use. The chip model has many advantages, such as high performance, low power consumption, and scalability.
The XCZU4CG-L2FBVB900E chip model has been designed to meet the needs of a range of industries, from consumer electronics to industrial automation. The model is expected to see growing demand in the future, as more companies look to capitalize on its features and capabilities. The chip model is also designed to be upgradable, allowing for future upgrades and expansions.
The original design intention of the XCZU4CG-L2FBVB900E chip model was to provide a reliable and powerful solution for a variety of applications. The chip model has the potential to be applied to advanced communication systems, as it is capable of handling high-bandwidth data transmission. The scalability of the chip model also allows for future upgrades, allowing for new features and capabilities to be added as needed.
Overall, the XCZU4CG-L2FBVB900E chip model is a powerful and versatile device that is suitable for a range of applications. It is designed with the HDL language, allowing for flexibility and ease of use. The chip model is expected to see growing demand in the future, as more companies look to capitalize on its features and capabilities. The chip model is also designed to be upgradable, allowing for future upgrades and expansions. It has the potential to be applied to advanced communication systems, as it is capable of handling high-bandwidth data transmission.
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1,914 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,263.1632 | $1,263.1632 |
| 10+ | $1,249.5808 | $12,495.8080 |
| 100+ | $1,181.6688 | $118,166.8800 |
| 1000+ | $1,113.7568 | $556,878.4000 |
| 10000+ | $1,018.6800 | $1,018,680.0000 |
| The price is for reference only, please refer to the actual quotation! | ||