AMD Xilinx
XCZU4CG-L1FBVB900I
XCZU4CG-L1FBVB900I ECAD Model
XCZU4CG-L1FBVB900I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 720 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Additional Feature | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | |
| Supply Voltage-Max | 742 mV | |
| Supply Voltage-Min | 698 mV | |
| Temperature Grade | INDUSTRIAL | |
| JESD-30 Code | R-PBGA-B900 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 900 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, BGA900,30X30,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 |
XCZU4CG-L1FBVB900I Datasheet Download
XCZU4CG-L1FBVB900I Overview
The Xilinx Zynq UltraScale+ MPSoC ZU4CG-L1FBVB900I is a powerful and versatile chip model that has the potential to be used in a variety of industries. It is an integrated solution for applications requiring high performance, high bandwidth, and low latency. The ZU4CG-L1FBVB900I features an ARM Cortex-A53 quad-core processor, two ARM Cortex-R5 dual-core processors, and a Mali-400MP2 GPU. It also includes a high-speed transceiver, a hardened memory controller, and a variety of I/O peripherals.
The ZU4CG-L1FBVB900I is designed to meet the needs of a variety of applications, including high-performance computing, embedded systems, and industrial automation. It is capable of handling complex tasks, such as machine learning, image processing, and video analytics. The chip model also supports the latest technologies, including 5G, Wi-Fi 6, and USB 3.1.
The ZU4CG-L1FBVB900I is a great choice for those looking to develop and popularize future intelligent robots. The chip model’s powerful processing capabilities and support for the latest technologies make it an ideal choice for robotics applications. To use the model effectively, technical talents with knowledge of embedded systems, computer vision, and machine learning are needed.
In addition to its potential applications in robotics, the ZU4CG-L1FBVB900I can also be used in a variety of other industries. For example, the chip model can be used in industrial automation systems to enable more efficient and reliable operations. It can also be used in medical imaging systems to improve accuracy and speed of diagnosis.
When it comes to industry trends and future development of related industries, the ZU4CG-L1FBVB900I is a great choice. The chip model is designed to support the latest technologies, so it can be used in a variety of applications. It is also capable of handling complex tasks, so it is well-suited for applications requiring high performance, high bandwidth, and low latency. Finally, the chip model is a great choice for those looking to develop and popularize future intelligent robots.
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5,723 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,104.5424 | $1,104.5424 |
| 10+ | $1,092.6656 | $10,926.6560 |
| 100+ | $1,033.2816 | $103,328.1600 |
| 1000+ | $973.8976 | $486,948.8000 |
| 10000+ | $890.7600 | $890,760.0000 |
| The price is for reference only, please refer to the actual quotation! | ||